1
James C K Lau, Richard P Malmgren, Kenneth Lui: Testing device for integrated circuits on wafer. TRW, December 26, 1995: US05479109 (113 worldwide citation)

An electrical testing device is provided for testing integrated circuits located on a wafer. The testing device employs a multi-layer test circuit having a plurality of contacts for contacting the integrated circuits on a wafer. The layers of the test circuit are embedded in a flexible transparent d ...


2
Hans G Mesch, Albert F Wollner, Charles E Gibson, Kenneth Lui: Interconnector attachment machine. TRW, Stuart O Lowry, Donald R Nyhagen, July 29, 1986: US04602417 (25 worldwide citation)

An integrated and automated multistation machine is provided for placement and attachment of electrically conductive interconnectors onto solar cells and the like. The machine comprises a rotatable turntable for supporting a plurality of solar cells in respective association with a corresponding plu ...


3
James C K Lau, Kenneth Lui, James A Hathaway, Ronald A DePace: Low stress waveguide window/feedthrough assembly. TRW, July 4, 1995: US05430257 (24 worldwide citation)

An apparatus for mounting a waveguide window or conduction member into a housing such that a smooth gradient of the coefficient of thermal expansion exists between the housing and the window or conduction member, thereby reducing the internal stress which results from ambient temperature variations. ...


4
Roy M Acker, Kenneth Lui: Hermetic electrical feedthrough for aluminum housing and method of making same. The United States of America represented by the Secretary of the Air Force, Joseph E Rusz, Robert Kern Duncan, July 15, 1980: US04213004 (20 worldwide citation)

A leak-tight joint between a Kovar ceramic feed-through and an aluminum housing is obtained by electron beam welding a short length of the outside surface of the Kovar cylindrical shell of the feedthrough to a region of nickel deposited on a thin wall cylindrical tube of aluminum formed in the alumi ...


5
James C Lau, Kenneth Lui, Richard P Malmgren: Single crystal diamond wafer fabrication. TRW, Ronald L Taylor, March 1, 1994: US05290392 (14 worldwide citation)

This invention discloses a method of fabricating a plurality of diamond semiconductor wafers from a single crystal diamond semiconductor boule, where the diamond boule is grown by a chemical vapor deposition (CVD) process. Initially, a single crystal diamond seed is polished and an impurity layer is ...


6
James C Lau, Maurice Lowery, Kenneth Lui: Focused ion beam for thin film resistor trim on aluminum nitride substrates. TRW, Ronald L Taylor, November 30, 1993: US05266529 (10 worldwide citation)

A method for trimming thin film resistors. A focused inert ion beam is employed to selectively remove portions of a resistive film deposited on a substrate.


7
Kenneth Lui: Electrodeposition of nickel-iron alloys having a low temperature coefficient and articles made therefrom. TRW, Donald R Nyhagen, John J Connors, November 4, 1980: US04231847 (7 worldwide citation)

There is disclosed a method of electrodepositing, on a substrate, a substantially homogeneous admixture (alloy) of nickel and iron containing substantially no iron oxides and having a low temperature expansion coefficient. The method includes the steps of forming an aqueous electrolyte solution of n ...


8
James C Lau, Richard P Malmgren, Kenneth Lui: Integrated waveguide/stripline transition. TRW, Ronald L Taylor, May 10, 1994: US05311153 (6 worldwide citation)

An integrated waveguide/stripline signal transition structure and method for fabricating the same are provided for allowing high frequency signal transitions. The signal transition structure includes a waveguide which has a conductive cavity for guiding electromagnetic waves therethrough. A first co ...


9
Kenneth Lui: Optical reflector having a nickel-iron alloy reflecting surface. TRW, John J Connors, Donald R Nyhagen, May 19, 1981: US04268124 (5 worldwide citation)

There is disclosed an optical mirror consisting essentially of an electrodeposited nickel-iron face sheet having a relatively low temperature coefficient of expansion on a lightweight graphite backup substrate having approximately the same temperature coefficient of expansion as the electrodeposited ...


10


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