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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, March 26, 2013: US08405196 (21 worldwide citation)

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plu ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, November 13, 2012: US08310036 (18 worldwide citation)

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plu ...


3
Belgacem Haba Belgacem (Bel) Haba
Kenneth Allen Honer, Belgacem Haba, David Ovrutsky, Charles Rosenstein, Guilian Gao: Method of forming a wafer level package. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 8, 2011: US08053281 (1 worldwide citation)

A method is provided for forming a microelectronic package at a wafer level. Such method can include providing a semiconductor wafer having a surface with a pattern of electrical contacts thereon. An interposer component can be provided which has a compliant dielectric layer bonded to a conductive l ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, May 27, 2014: US08735205

A method of fabricating a microelectronic unit can include providing a semiconductor element having front and rear surfaces, a plurality of conductive pads each having a top surface exposed at the front surface and a bottom surface remote from the top surface, and a first opening extending from the ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. Tessera, Tessera, LERNER DAVID et al, October 9, 2008: US20080246136-A1

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plu ...


6
Belgacem Haba Belgacem (Bel) Haba
Kenneth Allen Honer, Belgacem Haba, David Ovrutsky, Charles Rosenstein, Guilian Gao: Method of forming a wafer level package. Tessera, Tessera, LERNER DAVID et al, June 25, 2009: US20090162975-A1

A method is provided for forming a microelectronic package at a wafer level. Such method can include providing a semiconductor wafer having a surface with a pattern of electrical contacts thereon. An interposer component can be provided which has a compliant dielectric layer bonded to a conductive l ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. Tessera, Tessera, LERNER DAVID et al, September 9, 2010: US20100225006-A1

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plu ...


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David B Tuckerman, Kenneth Allen Honer, Bruce M McWilliams, Nicholas J Colella, Charles Liam Goudge: Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture. Tessera, Lerner David Littenbur Krumholz & Mentlik, July 28, 2009: US07566853 (16 worldwide citation)

Image sensors are provided having a plurality of photodetectors in a detector layer Optionally, an optically transparent substrate is provided for a rear-illuminated sensor architecture. The photodetectors may be arranged in three or more arrays. Typically, each array is contiguous and is associated ...


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Kenneth Allen Honer, Giles Humpston, David B Tuckerman, Michael J Nystrom: Wire bonded wafer level cavity package. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 28, 2010: US07858445 (12 worldwide citation)

A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges boundi ...


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Kenneth Allen Honer, Giles Humpston, David B Tuckerman, Michael J Nystrom: Wire bonded wafer level cavity package. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 11, 2008: US07449779 (11 worldwide citation)

A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges boundi ...



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