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Yuichi Kamayachi, Kenji Sawazaki, Morio Suzuki, Shoji Inagaki: Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof. Taiyo Ink Manufacturing, Ronald P Kananen, July 24, 1990: US04943516 (49 worldwide citation)

A photosensitive thermosetting resin composition, comprising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powder ...


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Kenji Sawazaki, Morio Suzuki, Shoji Inagaki, Yuichi Kamayachi: Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof. Taiyo Ink Manufacturing, HUANG JIAWEI, June 14, 1989: CN88108283

A photosensitive thermosetting resin composition, comrpising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powder ...


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Yuichi Kamayachi, Kenji Sawazaki, Morio Suzuki: Method for forming tin solder durable figures with photosensitive thermosetting resin composition. Taiyo Ink Manufacturing, WEI JINXI, February 2, 1994: CN93103607

A photosensitive thermosetting resin composition, comrpising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powder ...


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