1
Keith E Barrett: Test interposer for use with ball grid array packages assemblies and ball grid array packages including same and methods. Micron Technology, Trask Britt, June 27, 2000: US06081429 (95 worldwide citation)

An interposer for evaluating an electrical characteristic of a ball grid array package or of a semiconductor die thereof. The interposer includes electrically conductive vias positioned correspondingly to bond pads of the semiconductor die and to the electrical contacts or terminals of a carrier sub ...


2
Keith E Barrett: Test interposer for use with ball grid array packages, assemblies and ball grid array packages including same, and methods. Micron Technology, TraskBritt, September 17, 2002: US06452807 (34 worldwide citation)

An interposer for evaluating an electrical characteristic of a ball grid array package or of a semiconductor die thereof. The interposer includes electrically conductive vias positioned correspondingly to bond pads of the semiconductor die and to the electrical contacts or terminals of a carrier sub ...


3
Keith E Barrett: Techniques for generating serial presence detect contents. Micron Technology, Schwegman Lundberg Woessner & Kluth P A, December 19, 2006: US07152139 (4 worldwide citation)

Techniques are presented for automatically generating Serial Presence Detect (SPD) contents. Standards for specific values associated with SPD contents are electronically represented with SPD tokens and rules. When a memory module is identified, a string of needed SPD tokens are acquired for that me ...


4
Keith E Barrett: Techniques for generating serial presence detect contents. Micron Technology, Schwegman Lundberg & Woessner P A, December 30, 2008: US07472248

Techniques are presented for automatically generating Serial Presence Detect (SPD) contents. Standards for specific values associated with SPD contents are electronically represented with SPD tokens and rules. When a memory module is identified, a string of needed SPD tokens are acquired for that me ...



Click the thumbnails below to visualize the patent trend.