1
Hirohisa Matsuki, Kenichi Kado, Eiji Watanabe, Kazuyuki Imamura, Takahiro Yurino: Semiconductor device with pad structure. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, October 19, 1999: US05969424 (135 worldwide citation)

A semiconductor device equipped with secondary pads having adequate arrangement for an arbitrary packaging process. The secondary pads are connected with the primary pads of the semiconductor device with a novel lead wire structure, which is characterized by its low electric resistance, good mechani ...


2
Kazuyuki Imamura, Yasunori Fujimoto, Masaaki Seki, Tetsuya Fujisawa, Mitsutaka Sato, Ryuji Nomoto, Junichi Kasai, Yoshitaka Aiba, Noriaki Shiba: Semiconductor device having columnar electrode and method of manufacturing same. Fujitsu, Armstrong Westerman & Hattori, November 5, 2002: US06476503 (127 worldwide citation)

A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bonding wires and include enlarged outer ends. So ...


3
Hirohisa Matsuki, Kenichi Kado, Eiji Watanabe, Kazuyuki Imamura, Takahiro Yurino: Method for manufacturing semiconductor device with pad structure. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, May 15, 2001: US06232147 (69 worldwide citation)

A semiconductor device equipped with secondary pads having adequate arrangement for an arbitrary packaging process. The secondary pads are connected with the primary pads of the semiconductor device with a novel lead wire structure, which is characterized by its low electric resistance, good mechani ...


4
Nobukatsu Saito, Masaharu Minamizawa, Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Tadahiro Okamoto, Eiji Watanabe: Semiconductor device and manufacturing method thereof. Fujitsu, Westerman Hattori Daniels & Adrian, September 21, 2004: US06794273 (34 worldwide citation)

A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting ...


5
Yoshiyuki Yoneda, Masaharu Minamizawa, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Masaru Nukiwa, Osamu Yamaguchi, Yasunori Fujimoto, Takumi Ihara, Muneharu Morioka, Yukihiro Kuriki, Masaki Uchida: Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board. Fujitsu, Westerman Hattori Daniels & Adrian, April 5, 2005: US06875638 (23 worldwide citation)

A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor ...


6
Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Masaharu Minamizawa: Flip-chip semiconductor device having an improved reliability. Fujitsu, Armstrong Westerman & Hattori, May 20, 2003: US06566748 (22 worldwide citation)

A BGA semiconductor device includes a package substrate carrying thereon a semiconductor chip in a face-down state and a cap member covering the semiconductor chip on the package substrate, wherein the cap member has a optimized Young modulus smaller than about 20 GPa and a thermal conductivity exce ...


7
Makoto Amakai, Iwao Sugiura, Takanori Negishi, Yasuhiro Kawashima, Gen Kamurai, Kazuyuki Imamura: Structural analysis program, a structural analysis method, a structural analysis apparatus, and a production process of a semiconductor integrated circuit. Fujitsu Nagano Systems Engineering, Staas & Halsey, January 27, 2009: US07483818 (9 worldwide citation)

A structural analysis program which enables easy structural analysis in accordance with a finite element method based on data representing a two-dimensional shape. A two-dimensional model of a structure is produced in response to a manipulation input which designates a material arrangement pattern a ...


8
Yoshikazu Inumaru, Kazuyuki Imamura: Figure inspection method and apparatus. Sony Corporation, Ronald P Kananen, May 6, 1997: US05627911 (6 worldwide citation)

An article under inspection is rotated at pre-set angular increments which total more than 360.degree., to divide the figure inscribed on the curved surface of the article into plural fractions. Selected picture fractions which discard redundant overlapping picture data, is synthesized into picture ...


9
Kazuyuki Imamura, Osamu Yamaguchi, Yasunori Fujimoto, Toshiya Akamatsu: Method for mounting electronic part and paste material. Fujitsu, Westerman Hattori Daniels & Adrian, September 28, 2004: US06796025 (5 worldwide citation)

In a method for mounting an electronic part on a mounting substrate in that projection electrodes provided on the electronic part are welded by fusion to join connection terminals provided on the mounting substrate, the flux paste includes a base flux and metal grains having diameters smaller than t ...


10
Nobukatsu Saito, Masaharu Minamizawa, Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Tadahiro Okamoto, Eiji Watanabe: Semiconductor device and manufacturing method thereof. Fujitsu Semiconductor, Westerman Hattori Daniels & Adrian, July 13, 2010: US07754534 (3 worldwide citation)

A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting ...