1
Yoshiyuki Yoneda, Kazuto Tsuji: Semiconductor device in a resin package housed in a frame having high thermal conductivity. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, April 29, 1997: US05625222 (465 worldwide citation)

A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip ther ...


2
Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ryuji Nomoto, Eiji Watanabe, Seiichi Orimo, Masanori Onodera, Masaki Waki: Method of producing a semicondutor device having a lead portion with outer connecting terminal. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, August 12, 1997: US05656550 (189 worldwide citation)

This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device has a semiconductor chip, a lead member having a lead portion and an outer connecting terminal connected integrally to the lead por ...


3
Masafumi Tetaka, Shinichiro Maki, Nobuo Ohyama, Seiichi Orimo, Hideharu Sakoda, Yoshiyuki Yoneda, Akihiro Shigeno, Ryoichi Yokoyama, Fumitoshi Fujisaki, Masao Fukunaga, Kazuto Tsuji, Terumi Kamifukumoto, Kenji Itasaka, Masanori Onodera: Method and apparatus for fabricating semiconductor device. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, December 12, 2000: US06159770 (133 worldwide citation)

There is provided a method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections. The semiconductor elements ...


4
Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ryuuji Nomoto, Eiji Watanabe, Seiichi Orimo, Masanori Onodera, Junichi Kasai: Semiconductor device including a frame terminal. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, February 15, 2000: US06025650 (120 worldwide citation)

This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device comprises a semiconductor chip having a plurality of pads, a resin portion sealing said semiconductor chip and a terminal portion i ...


5
Yoshiyuki Yoneda, Kazuto Tsuji, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto, Masanori Onodera, Junichi Kasai: Device having resin package with projections. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, June 6, 2000: US06072239 (117 worldwide citation)

A device includes a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the ...


6
Yoshiyuki Yoneda, Ryuji Nomoto, Toshiyuki Motooka, Kazuto Tsuji, Junichi Kasai, Toshimi Kawahara, Hideharu Sakoda, Kenji Itasaka, Terumi Kamifukumoto: Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame. Fujitsu, Armstrong Westerman & Hattori, June 3, 2003: US06573121 (77 worldwide citation)

A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the ...


7
Yoshiyuki Yoneda, Ryuji Nomoto, Toshiyuki Motooka, Kazuto Tsuji, Junichi Kasai, Toshimi Kawahara, Hideharu Sakoda, Kenji Itasaka, Terumi Kamifukumoto: Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, April 23, 2002: US06376921 (74 worldwide citation)

A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the ...


8
Kazuto Tsuji, Tetsuya Hiraoka, Tsuyoshi Aoki, Junichi Kasai: Semiconductor device having spherical terminals attached to the lead frame embedded within the package body. Fujitsu, Staas & Halsey, March 8, 1994: US05293072 (64 worldwide citation)

A semiconductor device accommodated in a package includes a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the pac ...


9
Norio Taniguchi, Kazuto Tsuji, Junichi Kasai, Michio Sono: Semiconductor device with surface mount package adapted for vertical mounting. Fujitsu, Staas & Halsey, September 19, 1995: US05451815 (56 worldwide citation)

A semiconductor device includes vertical placement part for mounting the semiconductor device on a surface of a circuit board in a vertical position, and a connection part for making electrical connections between the circuit board and a semiconductor element. A stage is provided on which the semico ...


10
Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ryuji Nomoto, Eiji Watanabe, Seiichi Orimo, Masanori Onodera, Masaki Waki: Semiconductor device having a lead portion with outer connecting terminals. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, July 3, 2001: US06255740 (55 worldwide citation)

This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device has a semiconductor chip, a lead member having a lead portion and an outer connecting terminal connected integrally to the lead por ...