1
Kazuto Nishida: Method and device for mounting electronic component on circuit board. Matsushita Electric Industrial, Wenderoth Lind & Ponack L, January 3, 2006: US06981317 (32 worldwide citation)

When mounting an IC chip on a circuit board, bumps are formed on electrodes of the IC chip, and the bumps and the electrodes of the circuit board are aligned in position with each other with interposition of an insulative thermosetting resin having no conductive particle between the electrodes of th ...


2
Kazuhiro Nobori, Kazuto Nishida, Norihito Tsukahara: Circuit board having electrodes and pre-deposit solder receiver. Matsushita Electric Industrial, Wenderoth Lind & Ponack L, June 29, 1999: US05917156 (27 worldwide citation)

Copper electrodes are formed on a circuit board to be bonded with leads of a TAB driving liquid crystal. A pre-deposit solder receiver having solder printed thereon is also provided on the circuit board in alignment with and prior to an electrode to be first bonded with a lead, to form a sufficient ...


3
Kazuto Nishida, Hidenobu Nishikawa, Yoshinori Wada, Hiroyuki Otani: Electronic component unit. Panasonic Corporation, Wenderoth Lind & Ponack L, March 23, 2010: US07683482 (26 worldwide citation)

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. Th ...


4
Kazuto Nishida, Hidenobu Nishikawa, Yoshinori Wada, Hiroyuki Otani: Electronic parts mounting method and device therefor. Matsushita Electric Industrial, Wenderoth Lind & Ponack L, August 9, 2005: US06926796 (26 worldwide citation)

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. Th ...


5
Takashi Akiguchi, Kazuto Nishida: Method for connecting electrodes of plasma display panel. Matsushita Electric Industrial, Wenderoth Lind & Ponack L, July 11, 2000: US06086441 (23 worldwide citation)

A method is disclosed for connecting electrodes of a plasma display panel. The method includes overlapping a thick film electrode formed on a glass substrate with an electrode of a flexible substrate via an adhesive sheet having conductive particles dispersed therein, then, heating and pressuring fr ...


6
Kazuto Nishida: Method of bonding IC component to flat panel display. Matsushita Electric Industrial, Wenderoth Lind & Ponack, January 12, 1999: US05858806 (19 worldwide citation)

A method wherein an IC component is mounted to electrodes provided in a transparent portion of a flat panel display with interposition of an anisotropic conductive adhesive or film, includes steps of detecting, when mounting the IC component onto the transparent portion of the flat panel display for ...


7
Kazuto Nishida: IC component separating method and separating apparatus. Matsushita Electric Industrial, Wenderoth Lind & Ponack L, December 5, 2000: US06156150 (17 worldwide citation)

A method and apparatus for separating an IC component (1) from a board (3). The method includes the processes of positioning a tool (21) just above the IC component, thereafter moving the tool down into a specified position, making the tool cover the IC component that is mounted on the board via an ...


8
Kazuto Nishida, Kazuhiro Nobori, Yoshifumi Kitayama, Keiji Saeki: Method for bonding lead of IC component with electrode. Matsushita Electric Industrial, Wenderoth Lind & Ponack, August 31, 1993: US05240170 (9 worldwide citation)

A method for bonding leads of an IC component with electrodes of a circuit board includes the steps of using a mounting device to hold the IC component with flat portions of the leads inclined downward, mounting the IC component on the circuit board at a predetermined position thereof with the IC co ...


9
Hidenobu Nishikawa, Kazuto Nishida, Kazumichi Shimizu, Shuji Ono, Hiroyuki Otani: Electronic parts packaging method and electronic parts package. Matsushita Electric Industrial, Wenderoth Lind & Ponack L, April 8, 2008: US07355126 (7 worldwide citation)

An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical contact, the electron ...


10
Masahiro Ono, Shigeru Kondou, Kazuhiro Nishikawa, Kazuto Nishida, Hiroyuki Inoue, Osamu Miyazaki, Hiroshi Takeda, Tsuneyuki Ejima: Board connecting component and three-dimensional connecting structure using thereof. Matsushita Electric Industrial, McDermott Will & Emery, August 15, 2006: US07090502 (6 worldwide citation)

The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal ...