1
Ichiro Katayama, Masatami Iwaki, Kazumi Ikeda: Apparatus and method for chamfering wafer. Tokyo Seimitsu, David S Safran, Nixon Peabody, July 31, 2001: US06267648 (57 worldwide citation)

A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.


2
Daisuke Iguchi, Joji Wakita, Kazumi Ikeda, Osamu Ueno: Printed wiring board. Fuji Xerox, Oliff & Berridge, August 30, 2005: US06937480 (14 worldwide citation)

A printed wiring board is provided which can be applied even to circuit boards operating at high speed, and which can suppress electromagnetic wave radiation, and which can suppress a deterioration in density of mounting. At the printed wiring board, a first signal wire layer, a first ground layer h ...


3
Ichiro Katayama, Masatami Iwaki, Kazumi Ikeda: Apparatus and method for chamfering wafer. Tokyo Seimitsu, David S Safran, Nixon Peabody, August 13, 2002: US06431961 (6 worldwide citation)

A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.


4
Etsuo Noguchi, Kazumi Ikeda: Wafer chamfering method and apparatus. Tokyo Seimitsu, David S Safran, Sixbey Friedman Leedom & Ferguson, May 23, 2000: US06066031 (5 worldwide citation)

A wafer to be chamfered is supported in such a manner as to rotate and to move in the X-axis direction and the Y-axis direction which are perpendicular to one another, and a periphery grinding wheel is rotatably placed on the Y-axis. To chamfer a circular part of the wafer, the circular part of the ...


5
Tomoki Sekiguchi, Toshiaki Arai, Hiroshi Furukawa, Kazumi Ikeda: Computer system and method of handling trouble of computer system. Hitachi, Mattingly Stanger Malur & Brundidge P C, September 20, 2005: US06948100 (3 worldwide citation)

A manager transmits an I/O bus signal to an I/O bus manager in a computer at a predetermined point of time to inform the I/O bus manager of occurrence of an I/O bus fault. The I/O bus manager initializes an I/O bus and then informs a CPU in the computer of the I/O bus fault as an interruption to be ...


6
Kazumi Ikeda, Taro Kan: Nuclear reactor. Mitsubishi Heavy, Westerman Hattori Daniels & Adrian, July 12, 2011: US07978807 (3 worldwide citation)

A nuclear reactor includes a reflector and a flow path. The reflector reflects neutrons, contains graphite and a moderator having a smaller moderating power than the graphite, and is sectioned into plural parts along a direction of flow of fuel pebbles. The flow path is surrounded by the reflector, ...


7
Jun Takaya, Kazumi Ikeda: Wafer positioning method and apparatus. Tokyo Seimitsu, David S Safran, Nixon Peabody, May 16, 2000: US06062953 (3 worldwide citation)

The peripheral edge of a wafer is cramped by four cramp rollers which are able to move forward and backward with respect to a reference point, and thereby, the center of the wafer is positioned at the reference point. Then, a notch pin, which is provided on a reference line, is pressed against the p ...


8
Tomoki Sekiguchi, Toshiaki Arai, Hiroshi Furukawa, Kazumi Ikeda: Computer system and fault processing method in computer system. Hitachi, Mattingly Stanger Malur & Brundidge P C, September 16, 2008: US07426662 (2 worldwide citation)

A manager transmits an I/O bus signal to an I/O bus manager in a computer at a predetermined point of time to inform the I/O bus manager of occurrence of an I/O bus fault. The I/O bus manager initializes an I/O bus and then informs a CPU in the computer of the I/O bus fault as an interruption to be ...


9

10
Daisuke Iguchi, Joji Wakita, Kazumi Ikeda, Osamu Ueno: Printed wiring board. Fuji Xerox, Oliff & Berridge, November 28, 2002: US20020176236-A1

A printed wiring board is provided which can be applied even to circuit boards operating at high speed, and which can suppress electromagnetic wave radiation, and which can suppress a deterioration in density of mounting. At the printed wiring board, a first signal wire layer, a first ground layer h ...



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