1
Naoji Senba, Yuzo Shimada, Kazuaki Utsumi, Kenichi Tokuno, Ikushi Morizaki, Akihiro Dohya, Manabu Bonkohara: Semiconductor packing stack module and method of producing the same. NEC Corporation, Laff Whitesel & Saret, February 13, 2001: US06188127 (105 worldwide citation)

In a semiconductor package stack module, an LSI (Large Scale Integrated circuit) is mounted, via fine bumps, on a ceramic carrier substrate or a flexible carrier film on which wiring conductors are formed. After a seal resin has been injected, the chip is thinned by, e.g., grinding. A plurality of s ...


2
Kazuaki Utsumi, Shiro Yoshida, Mitsuo Saitou: Multi-layer printed board with an inductor providing a high impedance at high frequency. NEC Corporation, July 18, 2000: US06091310 (87 worldwide citation)

A laminated multi-layer printed board having at least a power source circuit layer, at least a ground layer and at least a signal layer includes a hole which extends through the board to the power source circuit layer. An inductor is provided in the hole.


3
Kazuaki Utsumi, Nobuaki Shohata, Tomeji Ohno: Voltage dependent nonlinear resistor. Nippon Electric, Laff Whitesel & Rockman, September 15, 1981: US04290041 (52 worldwide citation)

A "varistor" or voltage-dependent nonlinear resistor employs a ceramic base body having a voltage-dependent nonlinearity. First and second lead-out electrode layers are formed on first and second external surfaces, respectively, of the ceramic base body. Within and enclosed by the ceramic base body, ...


4
Kazuaki Utsumi, Hideo Takamizawa, Mitsuo Tsuzuki, Michihisa Suga, Sadayuki Takahashi: Method of manufacturing ceramic electronic device. NEC Corporation, Laff Whitesel Conte & Saret, August 30, 1988: US04766671 (51 worldwide citation)

A method of manufacturing a ceramic electronic device includes the steps of: forming a pattern of a predetermined shape made of a photosensitive resin; forming an electrical circuit element on a ceramic green sheet; stacking and pressing the pattern, the ceramic green sheet having the electrical cir ...


5
Yuzo Shimada, Yasuhiro Kurokawa, Kazuaki Utsumi: Multi-layer circuit board having a large heat dissipation. NEC Corporation, Burns Doane Swecker & Mathis, February 9, 1988: US04724283 (44 worldwide citation)

A multi-layer circuit board is disclosed which includes a plurality of AlN ceramic layers stocked and combined as an integrated form and wiring layers interposed at different levels between the AlN ceramic layers. The wiring layers are made of a mixture of tungsten and AlN ceramic particles, the con ...


6
Yuzo Shimada, Kazuaki Utsumi, Teruyuki Ikeda, Masanori Suzuki: Multilayer ceramic substrate with interlayered capacitor. NEC Corporation, Laff Whitesel Conte & Saret, January 28, 1986: US04567542 (43 worldwide citation)

A multilayer ceramic substrate with an interlayered capacitor has a large electrostatic capacity and a high flexural strength, such as 1,500 Kg/cm.sup.2 or more, and yet is manufactured at a relatively low firing or sintering temperature. A first ceramic body includes a plurality of laminated first ...


7
Kazuaki Utsumi, Yuzo Shimada, Masanori Suzuki, Hideo Takamizawa: Multilayer substrate including layers of an alumina and borosilicate-lead-glass ceramic material. Nippon Electric, Laff Whitesel Conte & Saret, August 20, 1985: US04536435 (38 worldwide citation)

A multilayer glass-ceramic substrate comprises insulator layers of a composition consisting essentially of, when components are expressed as oxides in percent by weight, 40-60 percent of aluminum oxide, 1-40 percent of lead oxide, 1-30 percent of boron oxide, 2-40 percent of silicon dioxide, 0.01-25 ...


8
Tadanori Shimoto, Yoshitsugu Funada, Koji Matsui, Yuzo Shimada, Kazuaki Utsumi: Interconnection structures and method of making same. NEC Corporation, Sughrue Mion Zinn Macpeak & Seas PLLC, November 3, 1998: US05830563 (34 worldwide citation)

This invention relates to an interconnection structure comprising one or more insulating films and one or more layers of conductor electrode patterns, wherein at least one of the insulating films consists of a fluorene skeleton-containing epoxy acrylate resin, and to a method of making a multilayer ...


9
Keiji Nunomura, Kazuaki Utsumi, Yoshio Sano: Electroluminescent device with monolithic substrate. NEC Corporation, Burns Doane Swecker & Mathis, July 12, 1988: US04757235 (30 worldwide citation)

An electroluminescent device and corresponding methods for making the same are described. A thin film structure is disposed on top of a ceramic substrate having electrodes embedded therein. Ceramic material of high dielectric constant separates the internal electrodes from the thin-film structure in ...


10
Kazuhiro Ikuina, Yuzo Shimada, Kazuaki Utsumi: Packaged semiconductor device and method of manufacturing the same. NEC Corporation, McGuireWoods, October 10, 2000: US06130111 (27 worldwide citation)

A packaged semiconductor device includes an LSI chip, a chip size package integrally bonded to the LSI chip to mount and hold the LSI chip thereon in order to connect an electrode of a board on which the LSI chip is to be mounted and an electrode of the LSI chip to each other, an electrode formed on ...