1
Kazuyuki Imamura, Yasunori Fujimoto, Masaaki Seki, Tetsuya Fujisawa, Mitsutaka Sato, Ryuji Nomoto, Junichi Kasai, Yoshitaka Aiba, Noriaki Shiba: Semiconductor device having columnar electrode and method of manufacturing same. Fujitsu, Armstrong Westerman & Hattori, November 5, 2002: US06476503 (127 worldwide citation)

A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bonding wires and include enlarged outer ends. So ...


2
Masaki Waki, Junichi Kasai, Tsuyoshi Aoki, Toshiyuki Honda, Hirotaka Sato: Semiconductor device having a plurality of chips. Fujitsu, Staas & Halsey, October 31, 1995: US05463253 (126 worldwide citation)

A semiconductor device includes lead frames (21) respectively having first main surfaces and second main surfaces opposite to each other, bonding being able to be performed on the first and second main surfaces, a first semiconductor chip (22) arranged on first main surface sides of the lead frames, ...


3
Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ryuuji Nomoto, Eiji Watanabe, Seiichi Orimo, Masanori Onodera, Junichi Kasai: Semiconductor device including a frame terminal. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, February 15, 2000: US06025650 (119 worldwide citation)

This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device comprises a semiconductor chip having a plurality of pads, a resin portion sealing said semiconductor chip and a terminal portion i ...


4
Yoshiyuki Yoneda, Kazuto Tsuji, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto, Masanori Onodera, Junichi Kasai: Device having resin package with projections. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, June 6, 2000: US06072239 (115 worldwide citation)

A device includes a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the ...


5
Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake, Junichi Kasai, Nobuo Kamehara, Yasuo Yamagishi, Masataka Mizukoshi, Yutaka Yamada, Susumu Abe: Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, July 1, 1997: US05643831 (106 worldwide citation)

A method for fabricating a semiconductor device using a solder ball forming plate having cavities. The plate is made from a silicon plate having a flat surface in a crystallographic plane, and an orientation flat in a crystallographic plane. The cavities are formed on the flat surface of the plate b ...


6
Tetsuya Fujisawa, Mitsutaka Sato, Junichi Kasai, Masataka Mizukoshi, Kosuke Otokita, Hiroshi Yoshimura, Katsuhiro Hayashida, Akira Takashima, Masahiko Ishiguri, Michio Sono: Semiconductor device and semiconductor device unit for a stack arrangement. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, September 1, 1998: US05801439 (96 worldwide citation)

A semiconductor device includes a semiconductor element, a package sealing the semiconductor element, and leads for passing signals between the semiconductor element and an external device. Each of the leads has an inner-lead part sealed within the package and connected with the semiconductor elemen ...


7
Yoshiyuki Yoneda, Ryuji Nomoto, Toshiyuki Motooka, Kazuto Tsuji, Junichi Kasai, Toshimi Kawahara, Hideharu Sakoda, Kenji Itasaka, Terumi Kamifukumoto: Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame. Fujitsu, Armstrong Westerman & Hattori, June 3, 2003: US06573121 (76 worldwide citation)

A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the ...


8
Yoshiyuki Yoneda, Ryuji Nomoto, Toshiyuki Motooka, Kazuto Tsuji, Junichi Kasai, Toshimi Kawahara, Hideharu Sakoda, Kenji Itasaka, Terumi Kamifukumoto: Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, April 23, 2002: US06376921 (73 worldwide citation)

A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the ...


9
Atsushi Hatakeyama, Fumio Baba, Junichi Kasai, Mitsutaka Sato: Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, April 16, 1996: US05508565 (72 worldwide citation)

A semiconductor device includes a first chip having a circuit arrangement, and a plurality of first terminals formed on a main surface of the first chip and substantially arranged into a line. The semiconductor device also includes a second chip having a circuit arrangement identical to that of the ...


10
Mitsutaka Sato, Junichi Kasai: Semiconductor device and method of producing the same. Fujitsu, Staas & Halsey, May 21, 1996: US05519251 (71 worldwide citation)

A semiconductor device includes a semiconductor chip (11) having a top surface and a bottom surface, a plurality of leads (14) arranged under the bottom surface of the semiconductor chip (11), where the leads (14) have first ends (14a) electrically coupled to the semiconductor chip (11) and second e ...