1
Shinji Baba, Jun Shibata, Tetsuya Ueda: Substrateless resin encapsulated semiconductor device. Mitsubishi Denki Kabushiki Kaisha, Leydig Voit & Mayer, October 19, 1999: US05969426 (164 worldwide citation)

A semiconductor device includes an encapsulating resin encapsulating a semiconductor substrate, a lead pattern or a laminated wiring layers transferred or secured on the lower surface of the encapsulating resin and a plurality of external electrode disposed on the lower surface of the lead pattern. ...


2
Akiyoshi Sawai, Haruo Shimamoto, Toru Tachikawa, Jun Shibata: Plastic molded semiconductor package. Mitsubishi Denki Kabushiki Kaisha, Lowe Price LeBlanc & Becker, September 10, 1996: US05554887 (87 worldwide citation)

A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconduct ...


3
Kazunari Michii, Jun Shibata: Semiconductor package including stacked semiconductor chips. Renesas Technology, McDermott Will & Emery, December 28, 2004: US06836007 (60 worldwide citation)

A semiconductor package includes an upper substrate having an opening portion, a solder ball for connection between substrates arranged on the lower side of the upper substrate, a lower substrate arranged on the further lower side and having an opening portion, a solder ball for external connection ...


4
Takashi Kondo, Koji Bando, Jun Shibata, Kazuko Narutaki: Resin-sealed chip stack type semiconductor device. Mitsubishi Denki Kabushiki Kaisha, McDermott Will & Emery, April 8, 2003: US06545365 (58 worldwide citation)

A resin-sealed chip stack type semiconductor device comprises a substrate placed on many balls, a bottom chip to which wires are connected, a top chip to which wires are connected and mounted above the bottom chip, a non-conductive bonding layer which functions to bond and fix the two chips to each ...


5
Hideki Ishii, Kazunari Michii, Jun Shibata, Moriyoshi Nakashima: Semiconductor device. Mitsubishi Denki Kabushiki Kaisha, Leydig Voit & Mayer, September 3, 2002: US06445064 (57 worldwide citation)

A semiconductor device includes a first semiconductor package and a second semiconductor package which is mounted onto the first semiconductor package. The first semiconductor package has lands on an upper surface for mounting the second semiconductor package and lands on the lower surface for exter ...


6
Akiyoshi Sawai, Haruo Shimamoto, Toru Tachikawa, Jun Shibata: Plastic molded semiconductor package and method of manufacturing the same. Mitsubishi Denki Kabushiki Kaisha, McDermott Will & Emery, April 4, 2000: US06046071 (42 worldwide citation)

A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconduct ...


7
Shinji Baba, Jun Shibata, Tetsuya Ueda: Method of manufacturing semiconductor device. Mitsubushi Denki Kabushiki Kaisha, Leydig Voit & Mayer, June 6, 2000: US06071755 (39 worldwide citation)

A semiconductor device includes an encapsulating resin encapsulating a semiconductor substrate, a lead pattern or a laminated wiring layers transferred or secured on the lower surface of the encapsulating resin and a plurality of external electrode disposed on the lower surface of the lead pattern. ...


8
Akiyoshi Sawai, Haruo Shimamoto, Toru Tachikawa, Jun Shibata: Plastic molded semiconductor package and method of manufacturing the same. Mitsubishi Denki Kabushiki Kaisha, McDermott Will & Emery, November 10, 1998: US05834340 (37 worldwide citation)

A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconduct ...


9
Yomiyuki Yama, Masao Kobayashi, Jun Shibata, Shinji Baba, Masaki Watanabe: Semiconductor device with tape automated bonding element. Mitsubishi Denki Kabushiki Kaisha, Oblon Spivak McClelland Maier & Neustadt P C, March 24, 1998: US05731631 (35 worldwide citation)

A semiconductor device having improved heat dissipation property and electrical characteristics and applicable to an integrated circuit having a multiplicity of electrodes, and a method of fabricating the semiconductor device are disclosed. A surface of a semiconductor chip (1) on which a bump (2) i ...


10
Masaki Watanabe, Akiyoshi Sawai, Yoshikazu Narutaki, Tomoaki Hashimoto, Masatoshi Yasunaga, Jun Shibata, Hiroshi Seki, Kazuhiko Kurafuchi, Katsunori Asai: Method for manufacturing semiconductor device. Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering Corporation, Leydig Voit & Mayer, July 10, 2001: US06256875 (29 worldwide citation)

The minimum spacing between wires disposed on a printed circuit board of a printed circuit board ball grid array package is reduced. Wiring layers are narrower than in the prior art because they are not plated and because only one metal layer is plated on the wiring layers. The narrower wiring layer ...