1
David L Roper, James W Cady, James Wilder, James Douglas Wehrly Jr, Jeff Buchle, Julian Dowden: Pitch change and chip scale stacking system. Staktek Group, Andrews Kurth L, J Scott Denko, May 30, 2006: US07053478 (108 worldwide citation)

The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two int ...


2
James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr, Julian Dowden, Jeff Buchle: Chip scale stacking system and method. Staktek Group, June 10, 2003: US06576992 (105 worldwide citation)

The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, a pair of CSPs is stacked, with one CSP above the other. The two CS ...


3
Carmen D Burns, James G Wilder, Julian Dowden: Stacking system and method. Staktek Group, J Scott Denko, Steptoe & Johnson L, August 19, 2003: US06608763 (37 worldwide citation)

A system and method for selectively stacking and interconnecting individual integrated circuit devices to create a high density integrated circuit module. Connections between stack elements are made through carrier structures that provide inter-element connections that substantially follow an axis t ...


4
Russell Rapport, James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr, Jeff Buchle, Julian Dowden: Stacking system and method. Entorian Technologies, Fish & Richardson P C, February 24, 2009: US07495334 (3 worldwide citation)

The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, two CSPs are stacked, with one CSP disposed above the ...


5
James Cady, David L Roper, James G Wilder, Julian Dowden, Jeff Buchle: Wide data path stacking system and method. Staktek Group, J Scott Denko, Andrew Kurth L, September 9, 2003: US06618257 (2 worldwide citation)

Provided is a system and method for selectively stacking and interconnecting integrated circuit devices having a data path of n-bits to create a high-density integrated circuit module having a data path of greater than n-bits. Integrated circuits are vertically stacked one above the other. Where the ...


6
David L Roper, James W Cady, James Wilder, James Douglas Wehrly Jr, Jeff Buchle, Julian Dowden: Pitch change and chip scale stacking system and method. Staktek Group, Fish & Richardson P C, April 10, 2007: US07202555 (1 worldwide citation)

The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two int ...


7
Julian Partridge, James Douglas Wehrly, Julian Dowden, David L Roper, James W Cady: Stacked module systems and methods for CSP packages. Staktek Group, J Scott Denko, Andrews & Kurth, January 13, 2005: US20050009234-A1

The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. Multiple numbers of CSPs may be stacked in accordance with the present invention. The CSPs employed in stacked modules devised in accordance with the present invent ...


8
David L Roper, James W Cady, James Wilder, James Douglas Wehrly, Jeff Buchle, Julian Dowden: Pitch change and chip scale stacking system. Staktek Group, J Scott Denko, Andrews & Kurth, January 27, 2005: US20050018412-A1

The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two int ...


9
David L Roper, James W Cady, James Wilder, James Douglas Wehrly, Jeff Buchle, Julian Dowden: Pitch change and chip scale stacking system and method. Staktek Group, J Scott Denko, July 7, 2005: US20050146011-A1

The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two int ...


10
James W Cady, James Wilder, David L Roper, James Douglas Wehrly, Julian Dowden, Jeff Buchle: Stacking system and method. Staktek Group, J Scott Denko, Andrews & Kurth, July 24, 2003: US20030137048-A1

The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two int ...