1
Hans Fr Schmidt, Siegfried Rauchmaul, Juergen Bednarz: Three-dimensional printed circuit board. Siemens Aktiengesellschaft, Hill Van Santen Steadman & Simpson, April 16, 1991: US05008496 (51 worldwide citation)

A three dimensional printed circuit board having at least two rigid board sections capable of being arranged in different planes and flexibly connected by connecting sections between adjacent board sections is manufactured as a one-piece injection molded part of a thermoplastic molding material. The ...


2
Siegfried Rauchmaul, Hans Fr Schmidt, Juergen Bednarz, Karl Heinz Horsmann, Ralf Criens, Horst Scheffler, Hanns Heinz Peltz: Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant. Siemens Aktiengesellschaft, Hill Van Santen Steadman & Simpson, April 21, 1992: US05106785 (7 worldwide citation)

A component or assembly is accommodated in a housing formed of at least two joined housing parts. Terminal legs are conducted toward the outside of the housing. In order to enhance a sealing effect, and thus for protection against internal corrosion, an outside encapsulation of a thermoplastic plast ...


3
Siegfried Rauchmaul, Hans Fr Schmidt, Juergen Bednarz, Karl Heinz Horsmann, Ralf Criens, Horst Scheffler, Hanns Heinz Peltz: Method and an encapsulation for encapsulating electrical or electronic components or assemblies. Siemens Aktiengesellschaft, Hill Steadman & Simpson, December 27, 1994: US05376824 (5 worldwide citation)

A component or assembly is accommodated in a housing formed of at least two joined housing parts. Terminal legs are conducted toward the outside of the housing. In order to enhance a sealing effect, and thus for protection against internal corrosion, an outside encapsulation of a thermoplastic plast ...