1
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Edward Yang, Kun Lin Wu, Fu Yang Yu: Chemical-mechanical polishing pad. United Microelectronics, September 19, 2000: US06120366 (34 worldwide citation)

The invention provides a chemical-mechanical polishing pad, which includes a plurality of annular grooves and a plurality of streamline grooves designed according to principles of the hydrodynamics. The streamline grooves of polishing pad are designed according to flow equations derived from source ...


2
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Kun Lin Wu, Daniel Chiu, Chih Chiang Yang, Juan Yuan Wu, Hao Kuang Chiu: Chemical-mechanical polish machines and fabrication process using the same. United Microelectronics, Thomas Kayden Horstemeyer & Risley, September 25, 2001: US06293850 (15 worldwide citation)

A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurr ...


3
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Kun Lin Wu, Daniel Chiu, Chih Chiang Yang, Juan Yuan Wu, Hao Kuang Chiu: Chemical-mechanical polish machines and fabrication process using the same. United Microelectronics, Thomas Kayden Horstemeyer & Risley, February 6, 2001: US06183350 (10 worldwide citation)

A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurr ...


4
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Chia Jui Chang: Wafer polishing head. United Microelectronics, Oblon Spivak McClelland Maier & Neustadt P C, April 24, 2001: US06220930 (10 worldwide citation)

A wafer polishing head for planarizing a wafer. The wafer polishing head comprises a carrier, a retaining ring, a first pressure chamber, a second pressure chamber and an automatic control system. The retaining ring is surrounding the carrier. The first pressure chamber having a first inner pressure ...


5
Chien Hsin Lai, Juen Kuen Lin, Huang Yi Li, Kevin Yu: Closed loop concentration control system for chemical mechanical polishing slurry. United Microelectronics, Dickinson Wright PLLC, April 13, 2004: US06721628 (8 worldwide citation)

Polishing slurry is transported via piping to flow into the closed loop control system. First, the polishing slurry flows into the ultrasonic concentration detector. Original data of the polishing slurry that is determined by means of ultrasonic concentration detector is a fluid velocity at that tim ...


6
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Hao Kuang Chiu, Kun Lin Wu: Retainer ring design for polishing head of chemical-mechanical polishing machine. United Microelectronics, Christie Parker & Hale, May 16, 2000: US06062963 (5 worldwide citation)

A chemical-mechanical polishing machine having an improved wafer retainer ring design for the polishing head, comprising a polishing table, a polishing pad, a polishing head and a wafer retainer ring, wherein the polishing pad is above the polishing table, the polishing head is above the polishing p ...


7
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Chia Jui Chang: Chemical mechanical polishing machine. United Microelectronics, Hickman Stephens Coleman & Hughes, August 1, 2000: US06096162 (3 worldwide citation)

A CMP machine includes several polishing tables mounted on a carousel, which rotates in one direction. Each of the polishing tables includes a polishing pad. Each polishing pad can polish one wafer on its first surface. Each polishing pad also has one distributing duct used to supply slurry onto the ...


8
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng, Kun Lin Wu, Daniel Chiu, Chih Chiang Yang, Juan Yuan Wu, Hao Kuang Chiu: Chemical mechanical polish machines and fabrication process using the same. United Microelectronics, Thomas Kayden Horstemeyer & Risley, June 5, 2001: US06241582 (2 worldwide citation)

A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurr ...


9
Chien Hsin Lai, Juen Kuen Lin, Peng Yih Peng: Method for increasing working life of retaining ring in chemical-mechanical polishing machine. United Microelectronics, Jiawei Huang, J C Patents, March 27, 2001: US06206758 (2 worldwide citation)

A method for increasing the working life of retaining rings in a chemical-mechanical polishing machine. The method includes adding an extra pad between a retaining ring and a carrier so that the retaining ring is prevented from slippage and pressure on wafer can be evenly spread over the polishing p ...


10
Juen Kuen Lin, Chien Hsin Lai, Peng Yih Peng: Device for filtering slurry. United Microelectronics, Knobbe Martens Olson & Bear, April 18, 2000: US06051139 (2 worldwide citation)

A filtering device used to filter the slurry is disclosed, including a crossflow fan within the filter housing, and a driving mechanism relative to the crossflow fan under the filter housing to drive the crossflow fan spinning to agitate the slurry in the filter housing, so as to prevent the particl ...