1
Emanuele Frank Lopergolo, Lewis Sigmund Goldmann, Joseph Michael Sullivan, Charles Russell Tompkins Jr: High density electrical interconnect apparatus and method. International Business Machines Corporation, Ira D Blecker, Aziz M Ahsan, September 1, 1998: US05800184 (73 worldwide citation)

The present invention relates generally to a new apparatus and method for use in chip, module, card, etc., burn-in and/or test or electrical interconnection. More particularly, the invention encompasses an apparatus that is used as a temporary media between a chip, module, card, etc., that needs to ...


2
Ajay Prabhakar Giri, Joseph Michael Sullivan, Christopher Lee Tessler: Multichip module having chips on two sides. International Business Machines Corporation, Ira D Blecker, July 20, 2004: US06765152 (4 worldwide citation)

A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of packaging, a multilayer thin film structure mounted to the frame, and semiconductor devices mounted to the thin ...


3
Ajay Prabhakar Giri, Joseph Michael Sullivan, Christopher Lee Tessler: Method of forming a multichip module having chips on two sides. International Business Machines Corporation, Ira D Blecker, December 13, 2005: US06973715

A method of forming a multichip module in which a thin film structure is formed on a temporary carrier and then an electrically insulating frame is attached to the thin film structure. A semiconductor device is attached to the thin film structure and then the temporary carrier is removed. Lastly, at ...


4
Ajay Prabhakar Giri, Joseph Michael Sullivan, Christopher Lee Tessler: Multichip module having chips on two sides. Ira D Blecker, June 24, 2004: US20040118601-A1

A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of packaging, a multilayer thin film structure mounted to the frame, and semiconductor devices mounted to the thin ...


5
Ajay Prabhakar Giri, Joseph Michael Sullivan, Christopher Lee Tessler: Multichip module having chips on two sides. International Business Machines Corporation, International Business Machines Corporation, Dept 18g, April 1, 2004: US20040060732-A1

A multichip module including a frame having contacts suitable for making an electrical connection with an article, preferably a printed wiring board or similar, which is the next level of packaging, a multilayer thin film structure mounted to the frame, and semiconductor devices mounted to the thin ...