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Joseph G Ameen, Joseph Funari, David W Sissenstein Jr: Mutlilayered flexible circuit package. International Business Machines Corporation, Lawrence R Fraley, August 31, 1993: US05241454 (135 worldwide citation)

An electronic package which includes a rigid first substrate (e.g., ceramic) having a plurality of conductive pins spacedly located therein. These pins each include one end portion extending below an undersurface of the substrate for positioning and electrically coupling within a second substrate (e ...


2
Joseph G Ameen, William P Mortimer Jr, Victor P Yokimcus: Thermally conductive interface. W L Gore & Associates, David J Johns, August 13, 1996: US05545473 (79 worldwide citation)

A thermally conductive interface is provided suitable for thermal conduction, especially between electronic components. The preferred thermally conductive interface comprises an open structure fluoropolymer material, such as expanded polytetrafluoroethylene, with uncoated thermally conductive partic ...


3
Joseph G Ameen, Joseph E Korleski, William P Mortimer Jr, Victor P Yokimcus: Thermally conductive adhesive interface. W L Gore & Associates, Victor M Genco Jr, January 7, 1997: US05591034 (63 worldwide citation)

A thermally conductive interface is provided suitable for thermal conduction, especially between electronic components. The preferred thermally conductive interface comprises an open structure fluoropolymer material, such as expanded polytetrafluoroethylene, with uncoated thermally conductive partic ...


4
Joseph G Ameen, Joseph Funari, John A Goldfuss Jr: Thin film electronic device. International Business Machines Corporation, Lawrence R Fraley, October 15, 1991: US05057969 (31 worldwide citation)

A thin film electronic package which utilizes a circuitized substrate (e.g., a printed circuit board) having a flexible film carrier electrically coupled thereto. The film carrier includes a dielectric layer (e.g., polyimide) with first and second circuit layers located on opposite sides thereof. Th ...


5
Joseph G Ameen, Joseph Funari, David W Sissenstein Jr: Multilayered flexible circuit package. International Business Machines Corporation, Lawrence R Fraley, June 21, 1994: US05321884 (29 worldwide citation)

An electronic package which includes a rigid first substrate (e.g., ceramic) having a plurality of conductive pins spacedly located therein. These pins each include one end portion extending below an undersurface of the substrate for positioning and electrically coupling within a second substrate (e ...


6
Joseph G Ameen, Joseph Funari, John A Goldfuss Jr: Method for bonding thin film electronic device. International Business Machines Corporation, Lawrence R Fraley, May 26, 1992: US05115964 (20 worldwide citation)

A method of forming electrical connections between a flexible film carrier and an electronic device (e.g., semiconductor chip). The method comprises the steps of aligning the film carrier relative to the device having a plurality of solder mounds located on an upper surface thereof. The film carrier ...


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Joseph G Ameen, Joseph Funari, Ronald J Moore: Method of applying solder. International Business Machines, Lawrence R Fraley, May 18, 1993: US05211328 (17 worldwide citation)

A method of precisely depositing accurately defined quantities of solder onto high density circuit patterns on a substrate without use of a solder mask or the like wherein solder paste is originally deposited within a precisely defined transfer member (e.g., graphite block having holes drilled there ...


9
Joseph G Ameen, Charles A Joseph, Dennis L Rivenburgh, David W Sissenstein: Reducing chloride concentration. International Business Machines Corporation, Pollock Vande Sande & Priddy, November 9, 1982: US04358627 (11 worldwide citation)

A process for reducing the chloride concentration in a system which contains an ethylenically unsaturated chlorinated hydrocarbon, water and HCl which includes providing certain nitrogen-containing compounds in the system and contacting the system with a molecular sieve. The process surprisingly is ...


10
Joseph G Ameen, Glenn V Elmore, Anthony E Peter: Strippable solder mask material comprising polysulfone, silicon dioxide filler, and solvent. International Business Machines Corporation, Cyril A Krenzer, October 17, 1978: US04120843 (9 worldwide citation)

A polysulfone base stop resist material to protect gold thermocompression bonding sites on a circuit module during a solder dipping operation. Along with the thermoplastic, thermostable strippable base of polysulfone, the resist includes a solvent for the polysulfone and a filler which holds the mel ...