1
Christopher G Angulas, Patrick T Flynn, Joseph Funari, Thomas E Kindl, Randy L Orr: Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders. Inernational Business Machines, Lawrence R Fraley, April 20, 1993: US05203075 (201 worldwide citation)

A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coat ...


2
Joseph G Ameen, Joseph Funari, David W Sissenstein Jr: Mutlilayered flexible circuit package. International Business Machines Corporation, Lawrence R Fraley, August 31, 1993: US05241454 (135 worldwide citation)

An electronic package which includes a rigid first substrate (e.g., ceramic) having a plurality of conductive pins spacedly located therein. These pins each include one end portion extending below an undersurface of the substrate for positioning and electrically coupling within a second substrate (e ...


3
Joseph Funari, Terence C Godown, Scott D Reynolds, Bahgat G Sammakia: Pluggable electronic circuit package assembly with snap together heat sink housing. International Business Machines Corporation, Norman R Bardales, April 28, 1992: US05109318 (120 worldwide citation)

A pluggable electronic circuit package assembly for use with an edge type connector has a two piece heat sink housing. The heat sink housing has internal retention posts and internal posts receiving recesses that allow the two pieces to be snap fit together for easy assembly and disassembly. Also, a ...


4
Christopher G Angulas, Patrick T Flynn, Joseph Funari, Thomas E Kindl, Randy L Orr: Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders. International Business Machines Corporation, Lawrence R Fraley, November 16, 1993: US05261155 (113 worldwide citation)

A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coat ...


5
Joseph George Ameen, Joseph Funari: Multi-layer, multi-chip pyramid and circuit board structure. International Business Machines Corporation, Calfee Halter & Griswold, February 3, 1998: US05715144 (78 worldwide citation)

The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit b ...


6
Joseph Funari, Mary C Green, Scott D Reynolds, Bahgat G Sammakia: Electronic package with improved heat sink. International Business Machines, 1701 North Street Endicott NY 13760, July 18, 1989: US04849856 (76 worldwide citation)

An electronic package including a first substrate (e.g., printed circuit board), a semiconductor device (e.g., silicon chip), a second circuitized substrate (e.g. polyimide having chrome-copper chrome circuitry thereon) and a heat sink (e.g., extruded aluminum or copper). The heat sink includes plia ...


7
Joseph George Ameen, Joseph Funari: Multi-layer-multi-chip pyramid and circuit board structure and method of forming same. International Business Machines Corporation, Calfee Halter & Griswold, June 1, 1999: US05907903 (65 worldwide citation)

The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit b ...


8
Joseph Funari: Micro-surface welding. International Business Machines Corporation, Cyril A Krenzer, Gerald R Gugger, October 16, 1979: US04171477 (58 worldwide citation)

This invention relates to a method and apparatus for wire bonding a variety of metals in the interconnection of semiconductor chips to electronic package substrate circuitries. A pair of electrically conducting bonding tip members are provided which are electrically isolated from one another and whi ...


9
Joseph Funari, Ronald J Moore: Apparatus for soldering a semiconductor device to a circuitized substrate. International Business Machines, Lawrence R Fraley, June 29, 1993: US05222649 (57 worldwide citation)

An apparatus for bonding a semiconductor device onto a substrate (e.g., a printed circuit board) such that solder elements on the device are connected, respectively, to circuit elements on the substrate. The solder elements are heated by passing hot gas onto an opposing surface of the device such th ...


10
Joseph Funari, Ronald J Moore: Method for soldering a semiconductor device to a circuitized substrate. International Business Machines, Lawrence R Fraley, May 4, 1993: US05207372 (48 worldwide citation)

A method for bonding a semiconductor device onto a substrate (e.g., a printed circuit board) such that solder elements on the device are connected, respectively, to circuit elements on the substrate. The solder elements are heated by passing hot gas onto an opposing surface of the device such that, ...