1
Belgacem Haba Belgacem (Bel) Haba
Joseph Fjelstad, Masud Beroz, John W Smith, Belgacem Haba: Microelectric packages having deformed bonded leads and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 1, 2005: US06848173 (39 worldwide citation)

A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on th ...


2
Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Joseph Fjelstad, Belgacem Haba, Christopher M Pickett, John Smith: Microelectronic unit forming methods and materials. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 26, 2002: US06361959 (34 worldwide citation)

Electrically conductive elements such as terminals and leads are held on a support structure by a degradable connecting layer such as a adhesive degradable by heat or radiant energy. After connecting these elements to a microelectronic element such as a chip or wafer, the conductive elements are rel ...


3
Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Joseph Fjelstad, Belgacem Haba, Christopher M Pickett, John Smith: Microelectronic unit forming methods and materials. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 18, 2004: US06737265 (17 worldwide citation)

Releasable leads having an elongated fixed portion extend over a surface defined by a dielectric material of a component or by a semiconductor body. A semiconductor element having a conductive structure connected to a set of contacts is also disclosed. A method of making the conductive structure is ...


4
Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Thomas H DiStefano, Anthony B Faraci, Joseph Fjelstad, Belgacem Haba: Components with releasable leads and methods of making releasable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 17, 2001: US06261863 (8 worldwide citation)

A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions. ...


5
Belgacem Haba Belgacem (Bel) Haba
Thomas H DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light, John W Smith: Connection component with peelable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 27, 2006: US07067742 (5 worldwide citation)

A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support struc ...


6
Belgacem Haba Belgacem (Bel) Haba
Thomas H DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light, John W Smith: Method of making connection component. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 19, 2002: US06357112 (4 worldwide citation)

A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. ...


7
Belgacem Haba Belgacem (Bel) Haba
Thomas H Distefano, Joseph Fjelstad, Belgacem Haba: Coining tool and process of manufacturing same for making connection components. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 6, 2001: US06196042 (3 worldwide citation)

A tool having a coining projection is operative for forming a frangible portion in a lead of a microelectronic connection component by application of a compressive force. The coining projection is supported on a pedestal formed from a tool body. In an alternative embodiment, the pedestal is formed o ...


8
Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Thomas H DiStefano, Anthony B Faraci, Joseph Fjelstad, Belgacem Haba: Components with releasable leads and methods of making releasable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 1, 2003: US06541845 (3 worldwide citation)

A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions.


9
Belgacem Haba Belgacem (Bel) Haba
Para Kanagasabai Segaram, Joseph Fjelstad, Belgacem Haba: Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby. Silicon Pipe, Shemwell Gregory & Courtney, August 23, 2005: US06933610 (1 worldwide citation)

In a semiconductor device having a semiconductor die without an ESD circuit and a separate ESD circuit and an external lead, the external lead is first bonded to the separate ESD circuit. Thereafter, the separate ESD circuit is bonded to the semiconductor die. As a result, in the process of bonding ...


10
Belgacem Haba Belgacem (Bel) Haba
Joseph Fjelstad, Masud Beroz, John W Smith, Belgacem Haba: Microelectronic packages having deformed bonded leads and methods therefor. Lerner David Littenberg Krumholz & Mentlik, June 6, 2002: US20020068426-A1 (1 worldwide citation)

A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on th ...



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