1
Joseph A Benenati, Claude L Bertin, William T Chen, Thomas E Dinan, Wayne F Ellis, Wayne J Howell, John U Knickerbocker, Mark V Pierson, William R Tonti, Jerzy M Zalesinski: Rolling ball connector. International Business Machines Corporation, Robert A Walsh, March 19, 2002: US06358627 (106 worldwide citation)

An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ...


2
John Acocella, Donald R Banks, Joseph A Benenati, Thomas Caulfield, Karl G Hoebener, David P Watson, John S Corbin Jr: Solder ball interconnected assembly. International Business Machines Corporation, Michael E Belk, January 7, 1997: US05591941 (100 worldwide citation)

High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperatu ...


3
Eugene R Atwood, Joseph A Benenati, James J Dankelman, Horatio Quinones, Karl J Puttlitz, Eric J Kastberg: Zero force heat sink. International Business Machines Corporation, Ira D Blecker Esq, McGuireWoods, April 3, 2001: US06212070 (55 worldwide citation)

A heat sink in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package. The heat sink is connected to a frame which is connected to a printed circuit board or other suitable support on which the substrate is positioned. The heat sink, which ...


4
Eugene R Atwood, Joseph A Benenati, Giulio DiGiacomo, Horatio Quinones: Thermal enhancement approach using solder compositions in the liquid state. International Business Machines Corporation, Robert Curcio, DeLio & Peterson, August 28, 2001: US06281573 (49 worldwide citation)

Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and r ...


5
Joseph A Benenati, Claude L Bertin, William T Chen, Thomas E Dinan, Wayne F Ellis, Wayne J Howell, John U Knickerbocker, Mark V Pierson, William R Tonti, Jerzy M Zalesinski: Rolling ball connector. International Business Machines Corporation, James M Leas, January 23, 2001: US06177729 (43 worldwide citation)

An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ...


6
Eugene R Atwood, Joseph A Benenati, Giulio DiGiacomo, Horatio Quinones: Thermal enhancement approach using solder compositions in the liquid state. International Business Machines Corporation, James J Cioffi, December 2, 2003: US06656770 (34 worldwide citation)

Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and r ...


7
Joseph A Benenati, William T Chen, Lisa A Fanti, Wayne J Howell, John U Knickerbocker: Underfill preform interposer for joining chip to substrate. International Business Machines Corporation, Peter W Peterson, Ira D Blecker, DeLio & Peterson, July 10, 2001: US06258627 (26 worldwide citation)

An apparatus for and method of minimizing the thermo-mechanical fatigue of flip-chip packages. The interposer of the present invention, preferably comprising an organic polymer such as polyimide, contains apertures having conductive plugs inserted therein for joining a chip to a substrate in an elec ...


8
Eugene R Atwood, Joseph A Benenati, James J Dankelman, Horatio Quinones, Karl J Puttlitz, Eric J Kastberg: Zero force heat sink. International Business Machines Corporation, Steven J Soucar, Whitham Curtis & Whitham, September 8, 1998: US05805430 (13 worldwide citation)

A heat sink is placed in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package, without imparting stressful forces to the substrate by connecting the heat sink to a frame which is connected to a support such as a printed circuit board or ...


9
John R Behun, Joseph A Benenati: Apparatus for removing a heatsink from an electronic module or package. International Business Machines Corporation, Whitham & Marhoefer, March 29, 1994: US05297618 (3 worldwide citation)

A heatsink is provided which can be removably secured in a heat transfer relationship to an electronic module or package by an epoxy type adhesive. A screw is provided through one end of the heatsink directly over an edge of the module sealing cap. To remove the heatsink from the module, the screw i ...


10
Eugene R Atwood, Joseph A Benenati, Giulio DiGiacomo, Horatio Quinones: Thermal enhancement approach using solder compositions in the liquid state. International Business Machines Corporation, Delio & Peterson, October 4, 2001: US20010026957-A1 (2 worldwide citation)

Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and r ...