1
Bernd Goller, Gerald Ofner, Josef Thumbs, Holger Wörner, Robert Christian Hagen, Christian Stümpfl, Stefan Wein: Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, March 23, 2004: US06710455 (28 worldwide citation)

An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate ...


2
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Josef Thumbs, Stefan Wein, Holger Woerner: Electronic component with a plastic package and method for production. Infineon Technologies, Edell Shapiro & Finnan, October 2, 2007: US07276783 (26 worldwide citation)

An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of th ...


3
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stümpfl, Josef Thumbs, Stefan Wein, Holger Wörner: Electronic component and process for producing the electronic component. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, January 27, 2004: US06683374 (12 worldwide citation)

An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to ...


4
Alexandra Atzesdorfer, Klaus Heckmann, Josef Thumbs: Plastic compositions for sheathing a metal or semiconductor body. Infineon Technologies, Herbert L Lerner, Laurence A Greenberg, Werner H Stemer, April 2, 2002: US06365269 (9 worldwide citation)

The adhesion of plastic to metal surfaces is improved by adding a specific filler in the sheathing material. The filler is formed of spherical SiO


5
Wolfgang Schüsslbauer, Hans Amler, Josef Thumbs: Short pulse laser with amplifier and adjustable pulse sequence. Photon Energy, Mendelsohn Dunleavy P C, Steve Mendelsohn, May 2, 2017: US09640939

The invention relates to a short pulse laser (1) having a seed laser oscillator (2), a controllable pulse picker (4) for coupling out a laser pulse or a sequence of laser pulses, and an amplifier unit (5, 6) being mounted downstream of the pulse picker (5) and having at least one first amplifier sta ...


6
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stümpfl, Josef Thumbs, Stefan Wein, Holger Wörner: Electronic component with at least one semiconductor chip and method for its manufacture. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Gregory L Mayback, October 11, 2005: US06953992

The invention relates to an electronic component having at least one semiconductor chip and a flat chip carrier assigned to the semiconductor chip. Electrical connections between contact areas on an active chip surface of the semiconductor chip and contact terminal areas on an upper side of the chip ...


7
Wolfgang Schüsslbauer, Hans Amler, Josef Thumbs: Movable modular housing for a short pulse laser with integrated amplifier. Photon Energy, Mendelsohn Drucker & Dunleavy P C, Steve Mendelsohn, July 28, 2015: US09093817

The invention relates to a short pulse laser (1) having a first optical plate (3) on which a seed laser oscillator (4), a pulse picker (5), and a fiber coupling-in optical unit (6) are mounted so as to be mechanically stable in relation to one another, and second optical plate (7), which is separate ...


8
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Josef Thumbs, Stefan Wein, Holger Woerner: Electronic component with a plastic housing and method for production thereof. Edell Shapiro Finnan & Lytle, November 25, 2004: US20040232543-A1

An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of th ...


9
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stumpfl, Josef Thumbs, Stefan Wein, Holger Worner: Electronic component with at least one semiconductor chip and method for its manufacture. Lerner And Greenberg Pa, April 17, 2003: US20030071336-A1

The invention relates to an electronic component (2) with at least one semiconductor chip (4) and a flat chip carrier (6) assigned to the at least one semiconductor chip, electrical connections between contact areas (43) on an active chip surface (41) of the semiconductor chip and contact terminal a ...


10
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stumpfl, Josef Thumbs, Stefan Wein, Holger Worner: Electronic component and process for producing the electronic component. Lerner And Greenberg Pa, Patent Attorneys And Attorneys At Law, March 6, 2003: US20030042590-A1

An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to ...