1
Jong Heon Kim, Jong Youn Kim: Inter-frequency handoff execution method and apparatus in mobile communication system. LG Information & Communications, Fleshner & Kim, May 13, 2003: US06563807 (61 worldwide citation)

An inter-frequency handoff execution method in a mobile communication system according to the present invention includes the steps of: transmitting from a base station a data frame in which a data transmission section and a frequency search section exist to an arbitrary mobile terminal; executing da ...


2
Wan Jong Kim, Kyoung Joon Cho, Jong Heon Kim, Shawn Patrick Stapleton: Method and system for baseband predistortion linearization in multi-channel wideband communication systems. Dali Systems, Kilpatrick Townsend & Stockton, April 3, 2012: US08149950 (25 worldwide citation)

An efficient baseband predistortion linearization method for reducing the spectral regrowth and compensating memory effects in wideband communication systems using effective multiplexing modulation technique such as wideband code division multiple access and orthogonal frequency division multiplexin ...


3
Wan Jong Kim, Kyoung Joon Cho, Shawn Patrick Stapleton, Jong Heon Kim: N-way Doherty distributed power amplifier. Dali Systems, James E Eakin, March 30, 2010: US07688135 (21 worldwide citation)

A power amplifier using N-way Doherty structure for extending the efficiency region over the high peak-to-average power ratio of the multiplexing modulated signals such as wideband code division multiple access and orthogonal frequency division multiplexing is disclosed. In an embodiment, the presen ...


4
HYUN SOOK PARK, CHANG MOG JO, HEE CHEOL KANG, YUN MI LEE, YONG SUP CHOI, UN CHEOL SUNG, JONG HEON KIM, JAE KWANG RYU: Thin film deposition apparatus, Dünnfilmabscheidungssvorrichtung, Appareil de dépôt de film mince. SAMSUNG MOBILE DISPLAY, August 10, 2011: EP2354270-A1 (16 worldwide citation)

A thin film deposition apparatus that can be simply applied to produce large-sized display devices on a mass scale and that improves manufacturing yield. The thin film deposition apparatus includes a deposition source that discharges a deposition material a deposition source nozzle unit disposed at ...


5
Wan Jong Kim, Kyoung Joon Cho, Jong Heon Kim, Shawn Patrick Stapleton: Method and system for baseband predistortion linearization in multi-channel wideband communication systems. Dali Systems, Kilpatrick Townsend & Stockton, August 13, 2013: US08509347 (11 worldwide citation)

In some embodiments, a method of reducing adjacent channel power ratio and compensating memory effects of multi-channel wideband communication systems using multiplexing modulation techniques is provided. The method includes generating an address from samples of a baseband input signal of a communic ...


6
Young Woo Yun, Hak Seong Kim, Bong Hoe Kim, Joon Kui Ahn, Dong Youn Seo, Jung Hoon Lee, Ki Jun Kim, Suk Hyon Yoon, Eun Sun Kim, Jong Heon Kim: Method of transmitting channel quality information in mobile communication system. LG Electronics, Lee Hong Degerman Kang & Waimey, October 18, 2011: US08041308 (8 worldwide citation)

A method of exchanging channel quality information between a base station and a user equipment in a mobile communication system is disclosed. A method of transmitting channel quality information in a mobile communication system which transmits channel quality information from a user equipment to a b ...


7
Jong Heon Kim: Solder terminal and fabricating method thereof. CCUBE Digital, Marger Johnson & McCollom P C, August 10, 2004: US06774495 (7 worldwide citation)

A solder terminal and a fabrication method thereof are provided. According to one embodiment of the present invention, a solder terminal structure includes an adhesion metal layer formed on an electrode pad of a semiconductor device, a thermal diffusion barrier, a solder bonding layer, and a solder ...


8
Hyun Chul Lee, Cheol Lee Roh, Gyoo Wan Han, Seung Ho Myoung, Jong Heon Kim, Joon Hyung Kim, Sung Gon Kim, Yong Jin Lee: Substrate cutting apparatus and method of cutting substrate using the same. Samsung Display, Lee & Morse P C, February 26, 2013: US08383983 (4 worldwide citation)

A substrate cutting apparatus including: a stage to support a substrate; a laser generator to emit a laser beam; a beam oscillator to oscillate the laser beam onto a cutting line of the substrate, to heat the substrate; and a cooling unit to cool the heated substrate.


9
Jong Heon Kim: Solder terminal and fabricating method thereof. Ocube Digital, Marger Johnson & McCollom P C, May 24, 2005: US06897141 (4 worldwide citation)

A solder terminal and a fabrication method thereof are provided. According to one embodiment of the present invention, a solder terminal structure includes an adhesion metal layer formed on an electrode pad of a semiconductor device, a thermal diffusion barrier, a solder bonding layer, and a solder ...


10
Jong Heon Kim: Method of fabricating a wafer level package. Hynix Semiconductor, Ladas & Parry, March 2, 2004: US06699782 (4 worldwide citation)

A fabrication method of wafer level packages capable of improving reliability by maximizing a contact area of metal wiring and a conductive ball and of simplifying fabrication processes by reducing the number of sputtering. The disclosed method comprises the steps of: providing a substrate having a ...



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