1
John S Kresge, David N Light, Tien Y Wu: Laminated electronic package including a power/ground assembly. International Business Machines Corporation, Calfee Halter & Griswold, November 12, 1996: US05574630 (84 worldwide citation)

A power/ground structure and associated circuit card or board are provided in which the coefficient of thermal expansion of the power/ground structure and associated circuit board are closely matched to each other. The circuit board or card is formed of organic electrically-insulating material havin ...


2
Sylvia Adae Amoakoh, John S Kresge, Voya R Markovich, Thurston B Youngs Jr: Economical high density chip carrier. International Business Machines Corporation, William H Steinberg, Schmeiser Olsen & Watts, June 22, 2004: US06753612 (83 worldwide citation)

A flip-chip joinable substrate having non-plated-on contact pads. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A micr ...


3
John S Kresge, James R Wilcox: Thermal stress relieving substrate. International Business Machines Corporation, John R Pivnichny, Scully Scott Murphy & Presser, February 23, 1999: US05874776 (71 worldwide citation)

A substrate for connecting one element having a first coefficient of thermal expansion to another element having a differing coefficient of thermal expansion that will alleviate interconnection problems due to thermal mismatch.


4
Howard L Heck, John S Kresge: Monte carlo simulation design methodology. International Business Machines Corporation, Richard M Goldman, April 5, 1994: US05301118 (48 worldwide citation)

A two-stage Monte Carlo method of tolerancing components of an assembly is provided. Statistical measures of component features are not time invariant, but change over a production run. That is, the mean value of component feature measures and the standard distribution of the component feature measu ...


5
John S Kresge, Cheryl L Palomaki: Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate. Endicott Interconnect Technologies, Hinman Howard & Kattell, Lawrence R Fraley, Mark Levy, September 29, 2009: US07595454 (39 worldwide citation)

A method of making a circuitized substrate in which pairs of vertically oriented though holes are formed such that at least one of the through holes is partially embedded within a lower one, thus assuring a sound connection following subsequent lamination or other steps the substrate including such ...


6
Francis J Downes Jr, Donald S Farquhar, Elizabeth Foster, Robert M Japp, Gerald W Jones, John S Kresge, Robert D Sebesta, David B Stone, James R Wilcox: Electronic package with high density interconnect layer. International Business Machines Corporation, Lawrence R Fraley, Schmeiser Olsen &Watts, April 16, 2002: US06373717 (33 worldwide citation)

An electronic package, and method of making the electronic package, is provided. The package includes a semiconductor chip and an multi-layered interconnect structure having a high density interconnect layer such as an allylated surface layer. The semiconductor chip includes a plurality of contact m ...


7
John S Kresge, Robin A Susko, James W Wilson: Method and apparatus for flexibly connecting electronic devices. International Business Machines Corporation, Lawrence R Fraley, Schmeiser Olsen & Watts, September 21, 1999: US05956235 (31 worldwide citation)

A flexible interconnect for flexibly connecting an integrated circuit chip to a substrate. The flexible interconnect includes a flexible core, formed of a polymeric material, fully covered by a layer of an electrically conductive metal. A layer of a compliant material is provided beneath the input/o ...


8
John S Kresge, Robert D Sebesta, David B Stone, James R Wilcox: Electronic package for electronic components and method of making same. International Business Machines Corporation, Lawrence R Fraley, February 26, 2002: US06351393 (31 worldwide citation)

An electronic package and method of making the electronic package is provided. The package includes a semiconductor chip and an multi-layered interconnect structure. The semiconductor chip includes a plurality of contact members on one of its surfaces that are connected to the multi-layered intercon ...


9
Charles R Davis, Thomas P Duffy, Steven L Hanakovic, Howard L Heck, John T Kolias, John S Kresge, David N Light, Ajit K Trivedi: Method of fabricating a flex laminate package. International Business Machines Corporation, Richard M Goldman, April 15, 1997: US05620782 (30 worldwide citation)

Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outward ...


10
Charles R Davis, Thomas P Duffy, Steven L Hanakovic, Howard L Heck, John T Kolias, John S Kresge, David N Light, Ajit K Trivedi: Flex laminate package for a parallel processor. International Business Machines Corporation, Richard M Goldman, January 24, 1995: US05384690 (27 worldwide citation)

Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outward ...