1
David Sherrer
Matthew L Moynihan, Bruno M Sicard, Carl J Colangelo, John P Cahalen, Brian D Amos, Kevin S Horgan, John J Fisher, David W Sherrer: Optical interface assembly and method of formation. Rohm and Haas Electronics Materials, Jonathan D Baskin, November 6, 2007: US07292756 (12 worldwide citation)

Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the first portion. The second portion is c ...


2
David Sherrer
Matthew L Moynihan, Bruno M Sicard, Carl J Colangelo, John P Cahalen, Brian D Amos, Kevin S Horgan, John J Fisher, David W Sherrer: Optical interface assembly and method of formation. Edwards & Angell, July 28, 2005: US20050163431-A1

Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the first portion. The second portion is c ...


3
John P Cahalen, Maria Anna Rzeznik, John E Schemenaur, Rajan Hariharan: Capacitor structure. Rohm and Haas Electronic Materials, S Matthew Cairns, March 13, 2007: US07190016 (22 worldwide citation)

Structures including a capacitor dielectric material disposed on the surface of an electrode suitable for use in forming capacitors are disclosed. Methods of forming such structures are also disclosed.


4
Martin W Bayes, Peter W Hinkley, John P Cahalen, Peter A Benson: Composition for circuit board manufacture. Shipley Company L L C, Peter F Corless, Darryl P Frickey, Edwards & Angell, July 17, 2001: US06261466 (13 worldwide citation)

A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer. The composition comprises hydrogen peroxide, inorganic acid, an amine free of a surfactant group and optionally, a corrosion inhibitor. The composition is characterize ...


5
John P Cahalen, Wade Sonnenberg: Metallization process and component. Shipley Company L L C, Peter F Corless, Darryl P Frickey, Edwards & Angell, January 16, 2001: US06174647 (10 worldwide citation)

This invention is directed to a process for the selective metallization which utilizes multiple photoresist layers, using a buried palladium ligand which is then catalyzed using a PdBr selective catalyst. The Pd in the catalyst is then reduced to Pd


6
Joseph R Montano, John P Cahalen: Process for treating adhesion promoted metal surfaces with an organo-silcon post-treatment. Shipley Company L L C, John J Piskorski, June 1, 2004: US06743303 (2 worldwide citation)

A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous organo-silicon wetting composition after having formed the micro-roughened ...


7
John P Cahalen, Gary Hamm, George R Allardyce, David L Jacques: Enhanced method of forming nickel silicides. Rohm and Hass Electronic Materials, John J Piskorski, June 7, 2011: US07955978

Silicon containing substrates are coated with nickel. The nickel is coated with a protective layer and the combination is heated to a sufficient temperature to form nickel silicide. The nickel silicide formation may be performed in oxygen containing environments.


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9
Edgardo Anzures, Robert K Barr, Daniel E Lundy, John P Cahalen: Cleaning composition and method. Shipley Company, c o EDWARDS & ANGELL, October 23, 2003: US20030196685-A1

A cleaning composition and method for removing built-up residue and scum on a substrate. The cleaning composition contains a compound of formula: R—[O-(AO)n]m—Z where R is a hydrophobe, AO is a hydrophile, Z is a nonionic or anionic capping group, n is an integer of from 1 to 200 and m is an integer ...


10
Joseph R Montano, John P Cahalen: Process for treating adhesion promoted metal surfaces with an organo-silcon post-treatment. Shipley Company, Edwards & Angell, Dike Bronstein Roberts & Cushman IP Group, September 19, 2002: US20020132056-A1

A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous organo-silicon wetting composition after having formed the micro-roughened ...



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