1
Brian S Beaman, Fuad E Doany, Keith E Fogel, James L Hedrick Jr, Paul A Lauro, Maurice H Norcott, John J Ritsko, Leathen Shi, Da Yuan Shih, George F Walker: Three dimensional high performance interconnection package. International Business Machines Corporation, Daniel P Morris, December 6, 1994: US05371654 (318 worldwide citation)

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is fo ...


2
Brain S Beaman, Fuad E Doany, Keith E Fogel, James L Hedrick Jr, Paul A Lauro, Maurice H Norcott, John J Ritsko, Leathen Shi, Da Yuan Shih, George F Walker: Method of forming a three dimensional high performance interconnection package. International Business Machines Corporation, Daniel P Morris, July 2, 1996: US05531022 (212 worldwide citation)

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is fo ...


3
Perminder S Bindra, Jerome J Cuomo, Thomas P Gall, Anthony P Ingraham, Sung K Kang, Jungihl Kim, Paul Lauro, David N Light, Voya R Markovich, Ekkehard F Miersch, Jaynal A Molla, Douglas O Powell, John J Ritsko, George J Saxenmeyer Jr, Jack A Varcoe, George F Walker: Method of fabricating nendritic materials. International Business Machines Corporation, Daniel P Morris, Alvin J Riddles, February 9, 1993: US05185073 (82 worldwide citation)

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating wi ...


4
Eleftherios Adamopoulos, Jungihl Kim, Kang Wook Lee, Tae S Oh, Terrence R O Toole, Sampath Purushothaman, John J Ritsko, Jane M Shaw, Alfred Viehbeck, George F Walker: Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier. International Business Machines Corporation, Scully Scott Murphy & Presser, December 10, 1996: US05582858 (79 worldwide citation)

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality ...


5
Perminder S Bindra, Jerome J Cuomo, Thomas P Gall, Anthony P Ingraham, Sung K Kang, Jungihl Kim, Paul Lauro, David N Light, Voya R Markovich, Ekkehard F Miersch, Jaynal A Molla, Douglas O Powell, John J Ritsko, George J Saxenmeyer Jr, Jack A Varcoe, George F Walker: Separable electrical connection technology. International Business Machines Corporation, Daniel P Morris, Alvin J Riddles, August 11, 1992: US05137461 (73 worldwide citation)

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating wi ...


6
Steven J Kirch, John R Lankard, John J Ritsko, Kurt A Smith, James L Speidell, James T Yeh: High energy laser mask and method of making same. May 8, 1990: US04923772 (42 worldwide citation)

The present invention is a mask and methods for making masks for use with a laser projection etching system. The unique mask is able to withstand the fluences of the high energy and high power lasers used without degrading. Specifically, the new projection etching masks are fabricated of patterned m ...


7
Warren D Grobman, Fahfu Ho, Jerry E Hurst Jr, John J Ritsko, Yaffa Tomkiewicz: Laser stimulated halogen gas etching of metal substrates. IBM Corporation, Perman & Green, November 11, 1986: US04622095 (38 worldwide citation)

A method of radiation induced dry etching of a metallized (e.g. copper) substrate is disclosed wherein the substrate is pattern-wise exposed to a beam of laser radiation in a halogen gas atmosphere which is reactive with the substrate to form a metal halide salt reaction product to accelerate the fo ...


8
Eleftherios Adamopoulos, Jungihl Kim, Kang Wook Lee, Tae S Oh, Terrence R O Toole, Sampath Purushothaman, John J Ritsko, Jane M Shaw, Alfred Viehbeck, George F Walker: Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier. International Business Machines Corporation, Scully Scott Murphy & Presser, July 5, 1994: US05326643 (24 worldwide citation)

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality ...


9
Sung K Kang, Sampath Purushothaman, John J Ritsko, Jane M Shaw, Subhash L Shinde: Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith. International Business Machines Corporation, Daniel P Morris, March 22, 1994: US05296189 (18 worldwide citation)

Methods of fabricating powders of metal particles containing grain growth control additives are described. A powder, metal particles, e.g., copper particles, are mixed with a powder of additive particles, e.g., alumina particles. The mixture is milled in a high energy ball mill to provide metal part ...


10
Eleftherios Adamopoulos, Jungihl Kim, Kang Wook Lee, Tae S Oh, Terrence R O Toole, Sampath Purushothaman, John J Ritsko, Jane M Shaw, Alfred Viehbeck, George F Walker: Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier. International Business Machines Corporation, Scully Scott Murphy & Presser, February 4, 1997: US05599582 (15 worldwide citation)

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality ...