11
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, February 12, 2008: US07329056 (13 worldwide citation)

Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted on the l ...


12
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Nuvotronics, Sherr & Vaughn PLLC, February 15, 2011: US07888793 (7 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


13
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Nuvotronics, Niels Haun, Dann Dorfman Herrell & Skillman PC, April 22, 2014: US08703603 (2 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


14
David Sherrer
Dan A Steinberg, John J Fisher, David W Sherrer, Mindaugas F Dautartas, William T Stacy: Optical waveguide switch. Shipley Company L L C, Niels Haun, Jonathan D Baskin, January 11, 2005: US06842552 (1 worldwide citation)

The present invention provides an optical switch. The switch includes a substrate and a first waveguide holding member. The switch also includes a second waveguide holding member disposed over the substrate and movable relative to the first waveguide holding member to provide a switching function. A ...


15
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Rohm And Haas Electronic Materials, March 29, 2007: US20070072321-A1

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


16
David Sherrer
James W Getz, David W Sherrer, John J Fisher: Electronic device packages and methods of formation. Rohm and Haas Electronic Materials, Jonathan D Baskin, Rohm and Haas Electronic Materials, October 15, 2009: US20090256251-A1

Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for he ...


17
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Rohm And Haas Electronic Materials, July 19, 2007: US20070164419-A1

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


18
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. April 7, 2011: US20110079893-A1

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


19
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Rohm And Haas Electronic Materials, February 22, 2007: US20070040268-A1

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


20
David Sherrer
David W Sherrer, John J Fisher: Coaxial waveguide microstructures having an active and methods of formation thereof. Rohm and Haas Electronic Materials, Sherr & Vaughn Pllc, March 5, 2009: US20090058569-A1

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor ...