1
David Sherrer
David W Sherrer, John J Fisher: Coaxial waveguide microstructures and methods of formation thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, March 14, 2006: US07012489 (92 worldwide citation)

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor ...


2
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and method for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, October 31, 2006: US07129163 (41 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


3
David Sherrer
David W Sherrer, John J Fisher: Coaxial waveguide microstructures having an active device and methods of formation thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, December 12, 2006: US07148772 (38 worldwide citation)

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor ...


4
David Sherrer
James W Getz, David W Sherrer, John J Fisher: Electronic device packages and methods of formation. Samsung Electronics, Sughrue Mion PLLC, June 19, 2012: US08203207 (37 worldwide citation)

Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for he ...


5
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Nuvotronics, Sherr & Vaughn PLLC, November 11, 2008: US07449784 (33 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


6
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Nuvotronics, Sheer & Vaughn PLLC, March 24, 2009: US07508065 (33 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


7
David Sherrer
David W Sherrer, John J Fisher: Coaxial waveguide microstructures having an active device and methods of formation thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, July 29, 2008: US07405638 (31 worldwide citation)

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor ...


8
David Sherrer
David W Sherrer, John J Fisher: Coaxial waveguide microstructure having conductive and insulation materials defining voids therein. Nuvotronics, Sherr & Vaughn PLLC, May 24, 2011: US07948335 (30 worldwide citation)

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor ...


9
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, February 12, 2008: US07329056 (13 worldwide citation)

Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted on the l ...


10
David Sherrer
Matthew L Moynihan, Bruno M Sicard, Carl J Colangelo, John P Cahalen, Brian D Amos, Kevin S Horgan, John J Fisher, David W Sherrer: Optical interface assembly and method of formation. Rohm and Haas Electronics Materials, Jonathan D Baskin, November 6, 2007: US07292756 (12 worldwide citation)

Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the first portion. The second portion is c ...



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