1
Gregory Costrini, Ronald Dean Goldblatt, John Edward Heidenreich III, Thomas Leddy McDevitt: Method/structure for creating aluminum wirebound pad on copper BEOL. International Business Machines Corporation, Eugene I Shkurko Esq, Scully Scott Murphy & Presser, February 13, 2001: US06187680 (181 worldwide citation)

The present invention provides a method for fabricating an integrated circuit (IC) structure having an Al contact in electrical communication with Cu wiring embedded in the initial semiconductor wafer. In accordance with the method of the present invention, the Al contact is formed in areas of the I ...


2
John Howard Keller, Michael Scott Barnes, John Curt Forster, John Edward Heidenreich III: Apparatus for producing an inductive plasma for plasma processes. International Business Machines Corporation, Whitham Curtis Whitham & McGinn, July 22, 1997: US05650032 (28 worldwide citation)

An efficient RF coil for inductively coupled plasmas provides either capacitive or inductive coupling to the plasma. The coil has a layered structure including at least one RF coil, an insulator having a low dielectric constant and a second RF magnetic structure. The second RF magnetic structure may ...


3
Gregory Costrini, Ronald Dean Goldblatt, John Edward Heidenreich III, Thomas Leddy McDevitt: Method/structure for creating aluminum wirebound pad on copper BEOL. International Business Machines Corporation, Eugene I Shkurko, Scully Scott Murphy & Presser, December 25, 2001: US06333559 (19 worldwide citation)

The present invention provides a method for fabricating an integrated circuit (IC) structure having an Al contact in electrical communication with Cu wiring embedded in the initial semiconductor wafer. In accordance with the method of the present invention, the Al contact is formed in areas of the I ...



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