1
John C Carson, Ronald J Indin, Stuart N Shanken: Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip. Irvine Sensors Corporation, Thomas J Plante, September 13, 1994: US05347428 (289 worldwide citation)

A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder ...


2
John C Carson, Raphael R Some: Electronic module comprising a stack of IC chips each interacting with an IC chip secured to the stack. Irvine Sensors Corporation, Thomas J Plante, July 11, 1995: US05432729 (269 worldwide citation)

An electronic module comprising a multiplicity of prestacked IC chips, such as memory chips, and an IC chip, referred to as an active substrate or active backplane, to which the stack of chips is directly secured. A multiplicity of aligned solder bumps may interconnect the stack and the substrate, p ...


3
John C Carson, Stewart A Clark: High-density electronic processing package-structure and fabrication. Irvine Sensors Corporation, Thomas J Plante, July 2, 1985: US04525921 (202 worldwide citation)

A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with pas ...


4
John C Carson, Stewart A Clark: High-density electronic processing package--structure and fabrication. Irvine Sensors Corporation, Thomas J Plante, February 24, 1987: US04646128 (150 worldwide citation)

A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with pas ...


5
John C Carson, Robert E DeCaro, Ying Hsu, Michael K Miyake: Stackable modules and multimodular assemblies. Irvine Sensors Corporation, Plante & Strauss, December 23, 1997: US05701233 (142 worldwide citation)

Stacked, multimodular circuit assemblies are provided which comprise stacked, resealable, modules containing electronic circuitry, each module having a plurality of electrically conductive, embedded through-vias between the upper and major surfaces thereof. The through-vias are contained within the ...


6
John C Carson, Stewart A Clark: Detector array module-structure and fabrication. Irvine Sensors Corporation, Thomas J Plante, November 5, 1985: US04551629 (81 worldwide citation)

A photo detector array module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of photo-detectors on the focal plane end, and of thin film circuitry on the back plane end, each plane is etched to cut back the semiconducto ...


7
John C Carson, Stewart A Clark: Detector array module fabrication process. Irvine Sensors Corporation, Thomas J Plante, June 16, 1987: US04672737 (60 worldwide citation)

A photo-detector array module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of photo-detectors on the focal plane end, and of thin film circuitry on the back plane end, each plane is etched to cut back the semiconducto ...


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John C Carson: Combined staring and scanning photodetector sensing system having both temporal and spatial filtering. Irvine Sensors Corporation, Thomas J Plante, June 23, 1987: US04675532 (44 worldwide citation)

A photodetector sensing system is disclosed which combines staring and scanning features. By providing both temporal and spatial filtering, many system benefits are obtained. Each pixel in the viewed scene has a "dedicated" filter, which receives signals only from that pixel. By integrating time spa ...


10
John C Carson Jr, Robert T Hall, Divaker B Kenkare, Clarence R Robbins: Two product dispenser with cooperating telescoping cylinders. Colgate Palmolive Company, Kenneth A Koch, Herbert S Sylvester, Murray M Grill, June 14, 1977: US04029236 (35 worldwide citation)

A product dispenser for dispensing two products simultaneously comprising a first cylinder having a first product therein and having an end wall. The end wall has a tongue and groove joint with the first cylinder. The first cylinder is provided with a piston plate therein and the first cylinder in t ...