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John B Riley: Attachment assembly for integrated circuits. National Semiconductor Corporation, John L Maxin, January 5, 1999: US05856911 (238 worldwide citation)

An integrated circuit package has a top die attach area and a bottom heat spreader thermally coupled to the die for conducting heat generated by the die through a thermal interface in the main circuit board to a heat sink or heat pipe mounted underneath the main circuit board. The preferred thermal ...


12
Kyong Mo Bang, David Gibson, Young Gon Kim, John B Riley: Components, methods and assemblies for stacked packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 13, 2007: US07294928 (78 worldwide citation)

A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to ...


13
Philip Damberg, Craig S Mitchell, John B Riley, Michael Warner, Joseph Fjelstad: Stacked microelectronic assemblies and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 26, 2005: US06885106 (48 worldwide citation)

A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one atop the other with the first microelectronic element disposed between the second microelectronic element and the dielectric. The dielectric element has opposed first and secon ...


14
Kyong Mo Bang, David Gibson, Young Gon Kim, John B Riley III: Components, methods and assemblies for stacked packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 3, 2011: US07935569 (2 worldwide citation)

A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to ...


15
Kyong Mo Bang, David Gibson, Young Gon Kim, John B Riley: Components, methods and assemblies for stacked packages. Tessera, Lerner David Litenberg Krumholz & Mentlik, July 29, 2004: US20040145054-A1

A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to ...


16
Michael Warner, Ilyas Mohammed, Ronald Green, John B Riley: Stackable electronic device assembly and high G-force test fixture. Tessera, Tessera, LERNER DAVID et al, June 21, 2007: US20070138612-A1

A stackable chip assembly is disclosed, as are different embodiments relating to same. The chip assembly preferably includes at least two substrates with components mounted on each. The substrates are preferably situated with respect to one another such that components on one substrate extend toward ...


17
Kyong Mo Bang, David Gibson, Young Gon Kim, John B Riley: Components, methods and assemblies for stacked packages. Tessera, Tessera, LERNER DAVID et al, February 21, 2008: US20080042274-A1

A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to ...


18
William Walter Carlson, Michael Warner, Salvador A Tostado, John B Riley, Ronald Green, Ilyas Mohammed, Michael J Nystrom, Rolfe Tyson Gustus, David R Baker: Stackable electronic device assembly. Tessera, Tessera, LERNER DAVID et al, May 8, 2008: US20080105963-A1

A stackable chip assembly is disclosed, as are many different embodiments relating to same. The chip assembly preferably includes at least two substrates with components mounted on each. The substrates are preferably situated with respect to one another such that components on one substrate extend t ...


19
Philip Damberg, Craig S Mitchell, John B Riley, Michael Warner: Low-height multi-component assemblies. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 13, 2003: US20030048624-A1

A microelectronic assembly has a first microelectronic element, a second microelectronic element, and a structure which projects downwardly from the second microelectronic element and at least partially encompassing the first microelectronic element. The structure is at least partially flexible. A m ...


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