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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assemblies. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 12, 2006: US07149095 (41 worldwide citation)

A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 11, 2012: US08329581 (35 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 18, 2008: US07453157 (32 worldwide citation)

A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelect ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectonic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 29, 2010: US07745943 (15 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 16, 2011: US07999397 (2 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Methods of making microelectronic assemblies including folded substrates. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2003: US20030168725-A1 (1 worldwide citation)

A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, October 14, 2010: US20100258956-A1

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, September 6, 2007: US20070205496-A1

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, November 3, 2011: US20110269272-A1

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, December 29, 2005: US20050285246-A1

A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelect ...



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