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Joan K Vrtis, Joni G Hansen, Thomas J Fitzgerald, Carl L Deppisch: Coated heat spreaders. Intel Corporation, Blakely Sokoloff Taylor & Zafman, June 15, 2004: US06751099 (14 worldwide citation)

A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermal ...


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Joan K Vrtis, Joni G Hansen, Thomas J Fitzgerald, Carl L Deppisch: Method of a coating heat spreader. Intel Corporation, Blakely Sokoloff Taylor & Zafman, May 22, 2007: US07219421 (5 worldwide citation)

A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermal ...


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Joan K Vrtis, Michael James Glickman, Mark Bergman, Shurui Shang: Flexible printed circuit board hinge. Multek Technologies, Haverstock & Owens, August 1, 2017: US09723713 (1 worldwide citation)

In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, a flexible section of the printed circuit board is configured to have a non-linear portion that functions as a hinge when the flexible section is bent, flexed, twisted or otherwise subject ...


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Joan K Vrtis, Joni G Hansen, Thomas J Fitzgerald, Carl L Deppisch: Coated heat spreaders. Michael A Bernadicou, Blakely Sokoloff Taylor & Zafman, June 26, 2003: US20030117775-A1 (1 worldwide citation)

A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermal ...


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Mark Bergman, Joan K Vrtis: Rip stop on flex and rigid flex circuits. Multek Technologies, Haverstock & Owens, July 3, 2018: US10015880

A rip stop material is attached at a stress area of a flexible circuit board in order to strengthen the flexible circuit board and minimize ripping and cracking in the polyimide and/or the copper conductors of the circuit. A rip stop transition layer is formed and deposited at a location on the flex ...


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Mark Bergman, Shurui Shang, Joan K Vrtis: Embedded components in a substrate. Multek Technologies, Haverstock & Owens, December 13, 2016: US09521754

An embedded component is formed in a PCB stack by applying an adhesive layer across an entire surface of a copper layer and selectively positioning the component on a portion of the adhesive layer. A B stage pre-preg layer having a component cut-out is added onto the adhesive layer such that the com ...


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Joan K Vrtis, Michael James Glickman, Mark Bergman, Shurui Shang: Rigid to flexible PC transition. Multek Technologies, Haverstock & Owens, January 17, 2017: US09549463

A circuit board comprises one or more rigid sections, one or more flexible sections, and one or more transition areas where the circuit board transitions from the rigid section to the flexible section. One or more mechanically restrictive components are applied at a transition area to prevent failur ...


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Mark Bergman, Joan K Vrtis: Flexible circuit board and method of fabricating. Multek Technologies, Haverstock & Owens, May 23, 2017: US09661743

A flexible circuit board includes a center “rigid” section, such as a printed circuit stack, and an adjoining flexible multi-layer body that are fabricated from a common interconnect layer. A transition material is included at the interface between the center rigid section and the flexible multi-lay ...


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Mark Bergman, Joan K Vrtis: Mechanical measures to limit stress and strain in deformable electronics. Multek Technologies, Haverstock & Owens, December 13, 2016: US09521748

Mechanical measures strengthen a flexible circuit board or deformable electronic by manipulating the location and/or intensity of the stress concentration or to limit bending, torsion, and stretching. A material layer is patterned onto the flexible circuit board with a specific pattern and place of ...