1
Min Hsiung Lin, Shu Gao, Kung Shiuh Huang, Jian Ming Wang: Sequence-encoded multiple biometric template security system. Xirlink, Skjerven Morrill MacPherson, May 21, 2002: US06393139 (41 worldwide citation)

A security access method and/or apparatus is disclosed in the present invention. The present invention discloses a security method that verifies both the user's fingerprints and the fingerprint entering sequence to determine whether an access can be authorized. By using both the fingerprints an ...


2
Rezaur Rahman Khan, Ken Jian Ming Wang: Lead frame-BGA package with enhanced thermal performance and I/O counts. Broadcom Corporation, Sterne Kessler Goldstein & Fox PLLC, January 18, 2011: US07872335 (20 worldwide citation)

Methods and apparatus for integrated circuit (IC) packages with improved thermal performance and input/output capabilities are described. An integrated circuit (IC) package includes a leadframe, an IC die, a substrate having opposing first and second surfaces, a first wirebond, and a second wirebond ...


3
Emmanuel Kanterakis, Jian Ming Wang: Optical interconnect for high speed processors. InterDigital Technology Corporation, David Newman & Associates, May 7, 1996: US05515194 (18 worldwide citation)

An optical interconnect for use with SIMD processors, including holographic-optical elements, dove prisms, beamsplitters and a processor. Laser diodes, with each operating at a different wavelength, generate coherent-light beams at different wavelengths. A fiber combiner, an optical fiber and a fibe ...


4
Emmanuel Kanterakis, Jian Ming Wang: Optical interconnect for high speed processors. InterDigital Technology Corporation, David Newman & Associates P C, October 14, 1997: US05677778 (16 worldwide citation)

An optical interconnect for use with SIMD processors, including holographic-optical elements, dove prisms, beamsplitters and a processor. Laser diodes, with each operating at a different wavelength, generate coherent-light beams at different wavelengths. A fiber combiner, an optical fiber and a fibe ...


5
Rezaur Rahman Khan, Ken Jian Ming Wang: Integrated circuit package with etched leadframe for package-on-package interconnects. Broadcom Corporation, Fiala & Weaver P L L C, November 17, 2009: US07618849 (12 worldwide citation)

Methods, systems, and apparatuses for integrated circuit packages, and for package stacking, are provided. An electrically conductive frame is attached to a first surface of a substrate. The electrically conductive frame includes a perimeter ring portion, a plurality of leads, and a plurality of int ...


6
Emmanuel Kanterakis, Jian Ming Wang: Optical interconnect for high speed processor. InterDigital Technology Corporation, Volpe and Koenig P C, December 28, 1999: US06008918 (8 worldwide citation)

An optical interconnect for use with SIMD processors, including holographic-optical elements, dove prisms, beamsplitters and a processor. Laser diodes, with each operating at a different wavelength, generate coherent-light beams at different wavelengths. A fiber combiner, an optical fiber and a fibe ...


7
Emmanuel Kanterakis, Jian Ming Wang: Optical apparatus using a 2D-spatial light modulator. InterDigital Technology Corporation, Volpe and Koenig P C, May 13, 2003: US06563617 (8 worldwide citation)

An optical apparatus comprises a 2D-spatial light modulator, an input-ring array, an output-ring array and an optical interconnect. The 2D-spatial light modulator produces a modulated light beam for each of a plurality of processing elements. The modulated light beams have a plurality of light wavel ...


8
Rezaur Rahman Khan, Ken Jian Ming Wang: Integrated circuit package with etched leadframe for package-on-package interconnects. Broadcom Corporation, Fiala & Weaver P L L C, September 18, 2012: US08269323 (6 worldwide citation)

Methods, systems, and apparatuses for integrated circuit packages, and for package stacking, are provided. An electrically conductive frame is attached to a first surface of a substrate. The electrically conductive frame includes a perimeter ring portion, a plurality of leads, and a plurality of int ...


9
Emmanuel Kanterakis, Jian Ming Wang: Optical interconnect for high speed processors. InterDigital Technology Corporation, Volpe and Koenig P C, June 5, 2001: US06243180 (3 worldwide citation)

An optical interconnect for use with SIMD processors, including holographic-optical elements, dove prisms, beamsplitters and a processor. Laser diodes, with each operating at a different wavelength, generate coherent-light beams at different wavelengths. A fiber combiner, an optical fiber and a fibe ...


10
Chin Tien Chiu, Chih Chin Liao, Ken Jian Ming Wang, Han Shiao Chen, Cheemen Yu, Hem Takiar: Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging. SanDisk Corporation, Vierra Magen Marcus & DeNiro, April 8, 2008: US07355283 (3 worldwide citation)

A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding process, the rigid wave pattern effect ...