1
Qing Ma, Chun Mu, Harry Fujimoto, John Carruthers, Jian Li, Chuanbin Pan: Structures and processes for fabricating moisture resistant chip-on-flex packages. Intel Corporation, Robert G Winkle, November 28, 2000: US06154366 (245 worldwide citation)

A chip-on-flex package which includes at least one moisture barrier layer to prevent metal corrosion and delamination of flex component layers. An exemplary microelectronic package includes a microelectronic die having an active surface and at least one side, wherein the microelectronic die active s ...


2
Kevin Kwong Tai Chung, Xiaoming Shi, Jing Jian Li: RFID device for object monitoring, locating, and tracking. Avante International Technology, Clement A Berard Esq, Dann Dorfman Herrell & Skillman P C, January 15, 2008: US07319397 (137 worldwide citation)

An RFID monitoring arrangement comprises a first RFID device and a second RFID device for monitoring the first RFID device. The first RFID device transmits at least two messages each including unique identifying information and a power level code, wherein the transmitter power level corresponds to t ...


3
Zhengyang Xie, Jianfeng Gao, Zhongqi Liu, Jian Li, Hongfeng Huang, Lin Wang, Yunsheng Pi: Cordless indicia reader with a multifunction coil for wireless charging and EAS deactivation. Hand Held Products, Additon Higgins & Pendleton PA, October 25, 2016: US09478113 (128 worldwide citation)

A cordless indicia reader including a multifunction coil that can be configured to either transmit or receive electromagnetic energy is disclosed. In this way, the multifunction coil facilitates both the wireless charging of a battery and the wireless deactivation of electronic article surveillance ...


4
Quat T Vu, Jian Li, Qing Ma, Maria V Henao, Xiao Chun Mu: Integrated core microelectronic package. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, July 1, 2003: US06586822 (100 worldwide citation)

A microelectronic package including a microelectronic die disposed within an opening in a microelectronic packaging core, wherein an encapsulation material is disposed within portions of the opening not occupied by the microelectronic die. Build-up layers of dielectric materials and conductive trace ...


5
Quat T Vu, Jian Li, Steven Towle: Microelectronic substrate with integrated devices. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, May 11, 2004: US06734534 (99 worldwide citation)

A microelectronic substrate including at least one microelectronic die disposed within an opening in a microelectronic substrate core, wherein an encapsulation material is disposed within portions of the opening not occupied by the microelectronic dice, or a plurality microelectronic dice encapsulat ...


6
Quat T Vu, Jian Li, Steven Towle: Microelectronic substrates with integrated devices. Intel Corporation, Schwegman Lundberg Woessner & Kluth P A, July 18, 2006: US07078788 (96 worldwide citation)

A microelectronic substrate including at least one microelectronic device disposed within an opening in a microelectronic substrate core, wherein an encapsulation material is disposed within portions of the opening not occupied by the microelectronic devices, or a plurality microelectronic devices e ...


7
Kevin Kwong Tai Chung, Cynthia Ting Wah Chu, Xiaoming Shi, Jing Jian Li, Ming Zou: Object monitoring, locating, and tracking method employing RFID devices. Avante International Technology, Clement A Berard Esq, Dann Dorfman Herrell & Skillman PC, September 9, 2008: US07423535 (79 worldwide citation)

A method for monitoring a container having an RFID device interior comprises periodically transmitting messages including unique identifying information and receiving messages transmitted by the RFID device interior the container by a receiving device exterior the container. Some messages transmitte ...


8
Kevin Kwong Tai Chung, Cynthia Ting Wah Chu, Xiaoming Shi, Jing Jian Li: Object monitoring, locating, and tracking system employing RFID devices. Avante International Technology, Clement A Berard Esq, Dann Dorfman Herrell & Skillman, March 11, 2008: US07342497 (75 worldwide citation)

A system for monitoring a container comprises an RFID device interior the container and a receiving device exterior the container. The RFID device transmits messages each including unique identifying information, and the receiving device exterior the container receives and stores and/or relays messa ...


9
Mark Nixon, Michael Lucas, Arthur Webb, Herschel Koska, Jian Li, Larry Jundt, Dennis Stevenson, Robert Havekost, Michael Ott: Module class objects in a process plant configuration system. Fisher Rosemount Systems, Marshall Gerstein & Borun, May 9, 2006: US07043311 (75 worldwide citation)

A configuration system for a process plant uses module class objects to assist in configuring, organizing and changing the control and display activities within the process plant. Each module class object generically models or represents a process entity, such as a unit, a piece of equipment, a cont ...


10
Paul Hildebrant, Jian Li, Hans W Klein: Multimode output stage converting differential to single-ended signals using current-mode input signals. Lattice Semiconductor, October 19, 2004: US06806771 (60 worldwide citation)

An output block for an in-system programmable analog integrated circuit. The output block features an output amplifier that accepts a differential current-mode input signal and provides a single-ended output voltage. The output amplifier is also selectably operable as a linear amplifier, an integrat ...