1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Ronald Green, Ilyas Mohammed, Stuart E Wilson, Wael Zohni, Yoichi Kubota, Jesse Burl Thompson: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 13, 2007: US07176043 (28 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away f ...


2
Belgacem Haba Belgacem (Bel) Haba
Michael J Nystrom, David B Tuckerman, Belgacem Haba, Giles Humpston, Jesse Burl Thompson: Pin referenced image sensor to reduce tilt in a camera module. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 22, 2009: US07593636 (16 worldwide citation)

The present invention relates to a camera module. The camera module includes a circuit panel having a top side, a bottom side and transparent region, the circuit panel having conductors. The module further includes sensor unit disposed on the bottom side of the circuit panel, and the sensor unit inc ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Craig S Mitchell, Michael Warner, Jesse Burl Thompson: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 19, 2009: US07534652 (6 worldwide citation)

A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Ronald Green, Ilyas Mohammed, Stuart E Wilson, Wael Zohni, Yoichi Kubota, Jesse Burl Thompson: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 30, 2009: US07554206 (5 worldwide citation)

A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, IIyas Mohammed, Craig S Mitchell, Michael Warner, Jesse Burl Thompson: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070145550-A1

A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Ronald Green, IIyas Mohammed, Stuart E Wilson, Wael Zohni, Yoichi Kubota, Jesse Burl Thompson: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, April 5, 2007: US20070077677-A1

A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting ...


7
Belgacem Haba Belgacem (Bel) Haba
Michael J Nystrom, David B Tuckerman, Belgacem Haba, Giles Humpston, Jesse Burl Thompson: Pin referenced image sensor to reduce tilt in a camera module. Tessera, Tessera, LERNER DAVID et al, August 14, 2008: US20080191300-A1

The present invention relates to a camera module. The camera module includes a circuit panel having a top side, a bottom side and transparent region, the circuit panel having conductors. The module further includes sensor unit disposed on the bottom side of the circuit panel, and the sensor unit inc ...


8
Belgacem Haba Belgacem (Bel) Haba
Philip R Osborn, Belgacem Haba, Ellis Chau, Giles Humpston, Masud Beroz, Teck Gyu Kang, Dat Nghe Duong, Jae M Park, Jesse Burl Thompson, Richard Dewitt Crisp: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, August 7, 2008: US20080185705-A1

A microelectronic package includes a microelectronic element having a first face including contacts, and a flexible substrate having a first surface and a second surface, conductive posts projecting from the first surface and conductive terminals accessible at the second surface, at least some of th ...


9
Belgacem Haba Belgacem (Bel) Haba
Giles Humpston, Philip R Osborn, Jesse Burl Thompson, Yoichi Kubota, Chung Chuan Tseng, Robert Burtzlaff, Belgacem Haba, David B Tuckerman, Michael Warner: Packaged acoustic and electromagnetic transducer chips. Tessera, Lerner David Litenberg Krumholz & Mentlik, September 1, 2005: US20050189635-A1

Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at ...


10
Belgacem Haba Belgacem (Bel) Haba
Giles Humpston, Philip R Osborn, Jesse Burl Thompson, Yoichi Kubota, Chung Chuan Tseng, Robert Burtzlaff, Belgacem Haba, David B Tuckerman, Michael Warner: Packaged acoustic and electromagnetic transducer chips. Tessera, Lerner David Litenberg Krumholz & Mentlik, September 1, 2005: US20050189622-A1

Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at ...