51
Jerrold L King, Larry D Kinsman, Jerry M Brooks, David J Corisis: Reduced stress LOC assembly. Micron Technology, Trask Britt & Rossa, July 4, 2000: US06083777 (4 worldwide citation)

An LOC die assembly including a die dielectrically adhered to the underside of a lead frame. The adhesive is applied over a minimum cross-sectional area and number of attachment points to maximize flexure of leads extending over the active surface of the die. In this manner, flexure of the leads to ...


52
Walter L Moden, Jerrold L King, Jerry M Brooks: Methods for a low profile multi-IC chip package connector. Micron Technology, TraskBritt, November 5, 2002: US06475831 (4 worldwide citation)

A low profile multi-IC chip package for high speed application comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with buses formed ...


53
Jerrold L King, Jerry M Brooks: Semiconductor chip package. Micron Technology, Orminston & McKinney PLLC, May 2, 2006: US07038315 (3 worldwide citation)

A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsulating material to contact the conductive lead ...


54
Jerrold L King, J Mike Brooks, Walter L Moden: Adhesion enhanced semiconductor die for mold compound packaging. November 13, 2001: US06316292 (3 worldwide citation)

A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by electroplating or electroless coating techniq ...


55
Tongbi Jiang, Jerrold L King: Plastic lead frames for semiconductor devices. Micron Technology, TraskBritt, July 13, 2004: US06762485 (3 worldwide citation)

A conductive plastic lead frame and method of manufacturing, the same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is ...


56
Tongbi Jiang, Jerrold L King: Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication. Micron Technology, TraskBritt, April 8, 2003: US06544820 (3 worldwide citation)

A conductive plastic lead frame and method of manufacturing the same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment the lead frame is a ...


57
Jerrold L King, Jerry M Brooks: Method of forming a stack of packaged memory dice. Micron Technology, TraskBritt PC, April 26, 2005: US06884654 (2 worldwide citation)

A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board (PCB). One or more multiconductor insulating assemblies provide an interface between terminals of the integrated circuit semiconductor devi ...


58
Tongbi Jiang, Jerrold L King: Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication. Micron Technology, TraskBritt, January 11, 2005: US06841422 (2 worldwide citation)

A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is ...


59
Jerrold L King, Jerry M Brooks: Semiconductor chip package. Ormiston & McKinney PLLC, August 16, 2001: US20010013645-A1 (2 worldwide citation)

A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsulating material to contact the conductive lead ...


60
Tongbi Jiang, Jerrold L King: Plastic lead frames for semiconductor devices and packages including same. Micron Technology, TraskBritt, April 20, 2004: US06724073 (2 worldwide citation)

A conductive plastic lead frame and method of manufacturing same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a com ...



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