41
Warren M Farnworth, Jerrold L King: Single-piece molded module housing. Micron Technology, Trask Britt, May 15, 2001: US06233154 (7 worldwide citation)

An adapter or housing for a module, such as a single in-line memory module (SIMM) or the like, and method of using the same are herein disclosed where the SIMM and attached housing fit a predetermined shape SIMM socket. The housing replaces SIMM board material that would otherwise be used to help se ...


42
Walter L Moden, Jerrold L King, Jerry M Brooks: Low profile multi-IC chip package connector. Micron Technology, TraskBritt, August 10, 2004: US06773955 (7 worldwide citation)

A low profile multi-IC chip package for high-speed applications comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with buses forme ...


43
Jerrold L King, Jerry M Brooks: Method of forming a stack of packaged memory dice. Micron Technology, TraskBritt, August 15, 2006: US07091061 (6 worldwide citation)

A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board (PCB). One or more multiconductor insulating assemblies provide an interface between terminals of the integrated circuit semiconductor devi ...


44
Tongbi Jiang, Jerrold L King: Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication. Micron Technology, TraskBritt PC, September 25, 2001: US06294410 (6 worldwide citation)

A conductive plastic lead frame and method of manufacturing same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment the lead frame is a comp ...


45
Jerrold L King, J Mike Brooks, Walter L Moden: Adhesion enhanced semiconductor die for mold compound packaging. Micron Technology, Trask Britt & Rossa, June 2, 1998: US05760468 (6 worldwide citation)

A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by electroplating or electroless coating techniq ...


46
Warren M Farnworth, Jerrold L King: Single-piece molded module housing. Micron Technology, TraskBritt, August 24, 2004: US06781848 (6 worldwide citation)

An adapter or housing for a module, such as a single in-line memory module (SIMM) or the like, and method of using the same are herein disclosed where the SIMM and attached housing fit a predetermined shape SIMM socket. The housing replaces SIMM board material that would otherwise be used to help se ...


47
Tongbi Jiang, Jerrold L King: Plastic leads frames for semiconductor devices. Micron Technology, TraskBritt, November 13, 2001: US06316824 (5 worldwide citation)

A conductive plastic lead frame and method of manufacturing same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment the lead frame is a comp ...


48
Tongbi Jiang, Jerrold L King: Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication. Micron Technology, Trask Britt, September 26, 2000: US06124151 (5 worldwide citation)

A conductive plastic lead frame and method of manufacturing same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment the lead frame is a comp ...


49
Jerrold L King: Lead frame coining for semiconductor devices. Micron Technology, August 18, 1998: US05796158 (5 worldwide citation)

A semiconductor device comprises a semiconductor die having a circuit side and a lead frame having a plurality of lead fingers. Each of the lead fingers comprises a first side having a generally planar first portion which overlies the die and a second side having a first surface and a second surface ...


50
Jerrold L King, Leland R Nevill: Method of aligning and testing a semiconductor chip package. Micron Technology, Workman Nydegger & Seeley, July 16, 2002: US06420195 (5 worldwide citation)

An improved semiconductor chip package capable of independently aligning with testing equipment during the manufacturing phase of electrical testing. Independent alignment is realized by directly connecting the semiconductor chip package to the test alignment apparatus by fitting together two substa ...