1
Jerrold L King, Walter L Moden, Chender Huang: Method for producing high speed integrated circuits. Micron Technology, Wayne E Duffy, June 1, 1993: US05214845 (288 worldwide citation)

This invention creates a high speed semiconductor interconnect system which contains a plurality of signal traces, each in a flexible printed circuit, and each adhesively sandwiched between or adjacent to a flexible ground circuit and a flexible power circuit. The signal, power and ground circuits a ...


2
Jerrold L King, Jerry M Brooks: Semiconductor chip package. Micron Technology, Ormiston Korfanta Dunbar & Holland PLLC, October 14, 1997: US05677566 (278 worldwide citation)

A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsulating material to contact the conductive lead ...


3
Walter L Moden, Jerrold L King, Jerry M Brooks: Low profile multi-IC chip package connector. Micron Technology, Trask Britt, July 10, 2001: US06258623 (170 worldwide citation)

A low profile multi-IC chip package for high speed application comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with busses forme ...


4
Warren M Farnworth, Ed A Shrock, Scott Clifford, Jerrold L King, Walter Moden: Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer. Micron Technology, Stephen A Gratton, February 15, 1994: US05286679 (163 worldwide citation)

An improved method for attaching a semiconductor die to a leadframe is provided The improved method comprises forming a patterned adhesive layer on a side of a semiconductor wafer prior to singulation of the dies from the wafer. The adhesive layer is patterned such that wire bonding pads on the dies ...


5
David J Corisis, Tracy Reynolds, Michael Slaughter, Daniel Cram, Leland R Nevill, Jerrold L King: Integrated circuit package including lead frame with electrically isolated alignment feature. Micron Technology, TraskBritt, June 12, 2001: US06246108 (147 worldwide citation)

An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature inc ...


6
Walter L Moden, Jerrold L King, Jerry M Brooks: Low profile multi-IC chip package connector. Micron Technology, TraskBritt, May 1, 2001: US06225689 (141 worldwide citation)

A low profile multi-IC chip package for high speed application comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with buses formed ...


7
David J Corisis, Tracy Reynolds, Michael Slaughter, Daniel Cram, Leland R Nevill, Jerrold L King: Integrated circuit package alignment feature. Micron Technology, Trask Britt & Rossa, April 11, 2000: US06048744 (126 worldwide citation)

An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature inc ...


8
Jerrold L King, Jerry M Brooks, Warren M Farnworth, George P McGill: Semiconductor assembly utilizing elastomeric single axis conductive interconnect. Micron Technology, Wells St John & Roberts, August 18, 1992: US05140405 (116 worldwide citation)

An semiconductor assembly includes at least one die having substantially planar first and second engagement surfaces and external edges which define a die shape. A base having an opening formed therein receives the die. The base opening has peripheral edges which define an opening shape and size whi ...


9
Rich Fogal, Jerrold L King, Walter L Moden: Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape. Micron Technology, Stanley N Protigal, August 18, 1992: US05140404 (102 worldwide citation)

The invention described is directed to a packaged semiconductor chip. As detailed, the invention requires a reduced number of steps to attach a die to a lead frame. The invention uses a carrier material layered on one or two sides with thermoplastic which can be softened to a desired state by the ap ...


10
Jerrold L King, Jerry M Brooks: Multichip semiconductor package. Micron Technology, Workman Nydegger & Seeley, August 6, 2002: US06429528 (97 worldwide citation)

A multichip semiconductor package, and method of making is provided that has a plurality of semiconductor chips fabricated in electrical isolation one from another integrally on a singular coextensive substrate useful for numerous and varied semiconductor chip applications. The semiconductor chips, ...



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