1
Dana Gronbeck Jeffrey Calvert
Michael K Gallagher, Dana A Gronbeck, Timothy G Adams, Jeffrey M Calvert: Electronic devices having air gaps. Rohm and Haas Electronic Materials, Jonathan D Baskin, May 25, 2010: US07723850 (7 worldwide citation)

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an elec ...


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Jeffrey Calvert
Jeffrey M Calvert, Joseph F Lachowski: Photoresists comprising novolak resin blends. Rohm and Haas Electronic Materials, Peter F Corless, Rohm and Haas Electronic Materials, July 31, 2008: US20080182204-A1

Photoresist compositions are provided comprising a radiation sensitive component and at least two distinct novolak resins. In one aspect, photoresists of the invention exhibit notably high dissolution rates, such as in excess of 800 angstroms per second in aqueous developer solution. In another aspe ...


4
Jeffrey Calvert
Matthew L Grandbois, Harlan Robert Goltz, Jeffrey M Calvert, Matthew Lawrence Rodgers, Charles R Marston: Alpha-particle emitter removal. Dow Global Technologies, Rohm and Haas Electronic Materials, November 29, 2012: US20120298586-A1

Methods of purifying acidic metal solutions by removing at least a portion of alpha-particle emitting materials are provided. The purified metal solutions are useful in a variety of applications requiring low levels of alpha-particle emission.


5
Dana Gronbeck
Dana A Gronbeck, Michael K Gallagher, Jeffrey M Calvert, Gregory P Prokopowicz, Timothy G Adams: Electronic device manufacture. Shipley Company L L C, S Matthew Cairns, March 28, 2006: US07018678 (30 worldwide citation)

Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.


6
Dana Gronbeck
Michael K Gallagher, Dana A Gronbeck, Timothy G Adams, Jeffrey M Calvert: Air gap formation. Shipley Company L L C, Jonathan D Baskin, August 14, 2007: US07256127 (25 worldwide citation)

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an elec ...


7
Dana Gronbeck
Michael K Gallagher, Dana A Gronbeck, Timothy G Adams, Jeffrey M Calvert: Air gap formation. Shipley Company, Edwards & Angell, July 15, 2004: US20040137728-A1 (2 worldwide citation)

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an elec ...


8
Dana Gronbeck
Michael K Gallagher, Dana A Gronbeck, Timothy G Adams, Jeffrey M Calvert: Air gap formation. Shipley Company, Jonathan D Baskin, Rohm and Haas Electronic Materials, February 14, 2008: US20080038518-A1

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an elec ...


9
Dana Gronbeck
Dana A Gronbeck, Michael K Gallagher, Jeffrey M Calvert, Christopher P Sullivan: Electronic device manufacture. Shipley Company, S Matthew Cairns, c o EDWARDS & ANGELL, March 18, 2004: US20040052948-A1

Treatment procedures for organic polysilica layers are provided that improve the adhesion of layers of material that are subsequently applied to the treated organic polysilica layers. In particular, layers of organic polymeric material have improved adhesion to such treated organic polysilica layers ...


10
Dana Gronbeck
Dana A Gronbeck, Michael K Gallagher, Jeffrey M Calvert, Gregory P Prokopowicz, Timothy G Adams: Electronic device manufacture. Shipley Company, Edwards & Angell, February 19, 2004: US20040033700-A1

Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.



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