1
Wayne T Holcombe, Pavel Konecny, Miroslav Svajda, Jean Luc Nauleau, Robert Gordon Farmer: Apparatus and method for near-field communication. Silicon Laboratories, O Keefe Egan Peterman & Enders, October 18, 2011: US08041227 (67 worldwide citation)

A communication device is disclosed having optical and near-field communication capability. The device includes an optical transceiver circuit fabricated on an integrated circuit die and configured to transmit and receive far field signals. A near field transceiver circuit is also fabricated on the ...


2
Jean Luc Nauleau, Janos Erdelyi, William H McCalpin: Systems and apparatus for digital control of bias for transistors. Integration Associates, Vernon W Francissen, Francissen Patent Law P C, January 16, 2007: US07164310 (7 worldwide citation)

The present invention is directed toward a system and apparatus for digitally controlling a bias control signal for at least one transistor. The present invention provides for software writable registers that control the bias control signal. The present invention further provides for the bias contro ...


3
Jean Luc Nauleau, Wayne T Holcombe, Pierre Irissou: Method for producing a thin distributed photodiode structure. Integration Associates, Vernon W Francissen, Gardner Carton & Douglas, April 15, 2003: US06548878 (5 worldwide citation)

A method is shown for producing a distributed PN photodiode having a first active region of the photodiode that can be made arbitrarily thin. A fabrication substrate is doped to have a first conductivity type in order to form the first active region of the photodiode. A layer can also be formed upon ...


4
Ka Y Leung, Jean Luc Nauleau: Multiple die layout for facilitating the combining of an individual die into a single die. SILICON LABORATORIES, Trop Pruner & Hu P C, October 17, 2017: US09793240

An apparatus includes a wafer portion and a plurality of die fabricated in the wafer portion in a defined pattern such that the die are separated from each other by a dicing area or a street. The apparatus includes a conductive connection between given adjacent die. The conductive connection is elec ...


5
Wayne T Holcombe, Pavel Konecny, Miroslav Svajda, Jean Luc Nauleau, Robert Farmer: Apparatus and Method for Near-Field Communication. Integration Associates, Francissen Patent Law PC, January 28, 2010: US20100021176-A1

A communication device is disclosed having optical and near-field communication capability. The device includes an optical transceiver circuit fabricated on an integrated circuit die and configured to transmit and receive far field signals. A near field transceiver circuit is also fabricated on the ...


6
Ka Y Leung, Jean Luc Nauleau: Multiple die layout for facilitating the combining of an individual die into a single die. Silicon Laboratories, March 31, 2011: US20110073996-A1

A semiconductor wafer including a plurality of die fabricated therein in a defined pattern. They are separated from each other by a dicing area or street and at least a portion of adjacent die on the wafer include at least a conductive connection between given adjacent die that is electrically inter ...