1
Perminder S Bindra, Ross D Havens, Voya R Markovich, Jaynal A Molla: Interconnection method and structure for organic circuit boards. International Business Machines Corporation, July 25, 1995: US05435057 (205 worldwide citation)

Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.


2
Perminder S Bindra, Jerome J Cuomo, Thomas P Gall, Anthony P Ingraham, Sung K Kang, Jungihl Kim, Paul Lauro, David N Light, Voya R Markovich, Ekkehard F Miersch, Jaynal A Molla, Douglas O Powell, John J Ritsko, George J Saxenmeyer Jr, Jack A Varcoe, George F Walker: Method of fabricating nendritic materials. International Business Machines Corporation, Daniel P Morris, Alvin J Riddles, February 9, 1993: US05185073 (82 worldwide citation)

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating wi ...


3
Perminder S Bindra, Jerome J Cuomo, Thomas P Gall, Anthony P Ingraham, Sung K Kang, Jungihl Kim, Paul Lauro, David N Light, Voya R Markovich, Ekkehard F Miersch, Jaynal A Molla, Douglas O Powell, John J Ritsko, George J Saxenmeyer Jr, Jack A Varcoe, George F Walker: Separable electrical connection technology. International Business Machines Corporation, Daniel P Morris, Alvin J Riddles, August 11, 1992: US05137461 (73 worldwide citation)

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating wi ...


4
Raymond A Busacco, Fletcher W Chapin, David W Dranchak, Jaynal A Molla, George J Saxenmeyer Jr, Robert D Topa: Method of forming a conductive end portion on a flexible circuit member. International Business Machines Corporation, Lawrence R Fraley, August 24, 1993: US05237743 (52 worldwide citation)

A method of forming conductive end portions on a flexible circuit member having a dielectric layer (e.g., polyimide) with at least one conductive element (e.g., copper) thereon. The method comprises the steps of forming (e.g., punching) an opening through both dielectric and conductive element, prov ...


5
Perminder S Bindra, Ross Downey Havens, Voya R Markovich, Jaynal A Molla: Interconnection method and structure for organic circuit boards. International Business Machines Corporation, Pollock Vande Sande & Priddy, March 29, 1994: US05298685 (45 worldwide citation)

Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.


6
Michael A Gaynes, Jaynal A Molla: Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate. International Business Machines Corporation, Hugh D Jaeger, August 25, 1998: US05798050 (32 worldwide citation)

A process for fabrication of an electrically conductive adhesive film having a pattern of microscopic elongate metal particles which extend from one surface to the other to provide an interconnection between confronting conductive metal pads abutting the surface. The particles have sharp ends to pen ...


7
Raymond T Galasco, Jaynal A Molla: Method of solder bonding processor package. International Business Machines Corporation, Richard M Goldman, July 18, 1995: US05432998 (20 worldwide citation)

Disclosed is a method of laminating circuitized polymeric dielectric panels with pad to pad electrical connection between the panels. This pad to pad electrical connection is provided by a transient liquid phase formed bond of a joining metallurgy characterized by a non-eutectic stoichiometry compos ...


8
Nicholas D Rizzo, Mark A Durlam, Michael J Roll, Kelly Kyler, Jaynal A Molla: Magnetic shielding for electronic circuits which include magnetic materials. Freescale Semiconductor, Patricia S Goddard, Kim Marie Vo, August 30, 2005: US06936763 (10 worldwide citation)

Shielded electronic integrated circuit apparatus (5) includes a substrate (10), with an eletronic integrated circuit (15) formed thereon, and a dielectric region (12) positioned on the electronic integrated circuit. The dielectric region and the substrate are substantially surrounded by lower and up ...


9
Michael A Gaynes, Jaynal A Molla: Selectively filled adhesives for compliant, reworkable, and solder-free flip chip interconnection and encapsulation. International Business Machines Corporation, Hugh D Jaeger, June 8, 1999: US05910641 (10 worldwide citation)

An electrically conductive adhesive film having a pattern of microscopic elongate metal particles which extend from one surface to the other to provide an interconnection between confronting conductive metal pads abutting the surface. The particles have sharp ends to penetrate the oxide coating on t ...


10
Curtis D Moyer, Peter A Smith, Robert H Reuss, Troy A Trottier, Steven A Voight, Diane A Carrillo, Kevin J Nordquist, Jaynal A Molla, David W Jacobs, Kathleen A Tobin: Field emission device having a vacuum bridge focusing structure and method. Motorola, S Kevin Pickens, Kevin D Wills, October 24, 2000: US06137213 (9 worldwide citation)

A field emission device (100, 150) includes a cathode plate (102, 180) having electron emitters (116), an anode plate (104, 170) having a phosphor (107, 207, 307, 407) activated by electrons (119) emitted by electron emitters (116), and a vacuum bridge focusing structure (118, 158, 218, 318) for foc ...