1
Warren M Farnworth, Alan G Wood, William M Hiatt, James M Wark, David R Hembree, Kyle K Kirby, Pete A Benson: Multi-dice chip scale semiconductor components and wafer level methods of fabrication. Micron Technology, Stephen A Gratton, January 11, 2005: US06841883 (394 worldwide citation)

A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back side of the bas ...


2
James M Wark: Method of fabricating flip-chip on leads devices and resulting assemblies. Micron Technology, Trask Britt & Rossa, October 6, 1998: US05817540 (196 worldwide citation)

A semiconductor die assembly and methods of forming same comprising a lead frame having a plurality of lead fingers and a semiconductor die having a plurality of electric contact points on an active surface of said semiconductor die. The electric contact points are located or rerouted on the semicon ...


3
James M Wark: Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice. Micron Technology, Trask Britt & Rossa, October 26, 1999: US05973403 (137 worldwide citation)

An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-chip pads define ...


4
Salman Akram, James M Wark: Packaged die on PCB with heat sink encapsulant. Micron Technology, Trask Britt & Rossa, February 2, 1999: US05866953 (124 worldwide citation)

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glo ...


5
James M Wark: Flip-chip on leads devices. Micron Technology, Trask Britt & Rossa, May 9, 2000: US06060769 (120 worldwide citation)

A semiconductor die assembly and methods of forming same comprising a lead frame having a plurality of lead fingers and a semiconductor die having a plurality of electric contact points on an active surface of said semiconductor die. The electric contact points are located or rerouted on the semicon ...


6
James M Wark: Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice. Micron Technology, Trask Britt & Rossa, December 9, 1997: US05696031 (113 worldwide citation)

An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-chip pads define ...


7
Warren M Farnworth, Alan G Wood, William M Hiatt, James M Wark, David R Hembree, Kyle K Kirby, Pete A Benson: Semiconductor component having plate, stacked dice and conductive vias. Micron Technology, Stephen A Gratton, March 3, 2009: US07498675 (97 worldwide citation)

A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back side of the bas ...


8
James M Wark, Salman Akram: Thin film capacitor coupons for memory modules and multi-chip modules. Micron Technology, Trask Britt, December 26, 2000: US06165814 (95 worldwide citation)

A semiconductor device including a thin capacitor coupon mounted to the backside of a semiconductor die. When mounted active surface up on a carrier substrate of a multi-chip module, the coupon is secured between the backside of the die and the substrate. When flip-chip connections or direct chip at ...


9
David R Hembree, John O Jacobson, James M Wark, Warren M Farnworth, Salman Akram, Alan G Wood: Interconnect for making temporary electrical connections with bumped semiconductor components. Micron Technology, Stephen A Gratton, August 3, 1999: US05931685 (91 worldwide citation)

An interconnect and system for establishing temporary electrical communication with semiconductor components having contact bumps are provided. The interconnect includes a substrate with patterns of contact members adapted to electrically contact the contact bumps. The substrate can be formed of a m ...


10
David R Hembree, John O Jacobson, James M Wark, Warren M Farnworth, Salman Akram, Alan G Wood: System and interconnect for making temporary electrical connections with bumped semiconductor components. Micron Technology, Stephen A Gratton, June 29, 1999: US05915977 (78 worldwide citation)

An interconnect and system for establishing temporary electrical communication with semiconductor components having contact bumps are provided. The interconnect includes a substrate with patterns of contact members adapted to electrically contact the contact bumps. The substrate can be formed of a m ...