1
Brian S Beaman, Fuad E Doany, Keith E Fogel, James L Hedrick Jr, Paul A Lauro, Maurice H Norcott, John J Ritsko, Leathen Shi, Da Yuan Shih, George F Walker: Three dimensional high performance interconnection package. International Business Machines Corporation, Daniel P Morris, December 6, 1994: US05371654 (318 worldwide citation)

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is fo ...


2
Brain S Beaman, Fuad E Doany, Keith E Fogel, James L Hedrick Jr, Paul A Lauro, Maurice H Norcott, John J Ritsko, Leathen Shi, Da Yuan Shih, George F Walker: Method of forming a three dimensional high performance interconnection package. International Business Machines Corporation, Daniel P Morris, July 2, 1996: US05531022 (212 worldwide citation)

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is fo ...


3
Juan Ayala Esquilin, William H Dickstein, James L Hedrick Jr, John C Scott, Arnold C Yang: Coatings for hot roll fusers. International Business Machines Corporation, Joseph G Walsh, November 13, 1990: US04970098 (40 worldwide citation)

A roll for hot fusing having a coating comprising a cross-linked elastomeric random copolymer of dimethylsiloxane and diphenylsiloxane and three additives, (1) from 40 to 55% by weight of small zinc oxide particles, (2) from 5 to 10% by weight of small graphite particles and (3) from 1 to 5% by weig ...


4
Ali Afzali Ardakani, Juan Ayala Esquilin, Bodil E Braren, Shahrokh Daijavad, Elizabeth Foster, James L Hedrick Jr, Jeffrey C Hedrick, Rodney T Hodgson, Ashit A Mehta, Steven E Molis, Jane M Shaw, Stephen L Tisdale, Alfred Viehbeck: Fluorinated carbon polymer composites. International Business Machines Corporation, Scully Scott Murphy & Presser, March 14, 1995: US05397863 (17 worldwide citation)

Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns. The composite can b ...


5
Ali Afzali Ardakani, Juan Ayala Esquilin, Bodil E Braren, Shahrokh Daijavad, Elizabeth Foster, James L Hedrick Jr, Jeffrey C Hedrick, Rodney T Hodgson, Ashit A Mehta, Steven E Molis, Jane M Shaw, Stephen L Tisdale, Alfred Viehbeck: Fluorinated carbon polymer composites. International Business Machines, Scully Scott Murphy & Presser, January 7, 1997: US05591285 (16 worldwide citation)

Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.


6
Ali Afzali Ardakani, Juan Ayala Esquilin, Bodil E Braren, Shahrokh Daijavad, Elizabeth Foster, James L Hedrick Jr, Jeffrey C Hedrick, Rodney T Hodgson, Ashit A Mehta, Steven E Molis, Jane M Shaw, Stephen L Tisdale, Alfred Viehbeck: Fluorinated carbon polymer composites. International Business Machines Corporation, Scully Scott Murphy & Presser, September 17, 1996: US05556899 (10 worldwide citation)

Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersi ...


7
Ali Afzali Ardakani, Juan Ayala Esquilin, Bodil E Braren, Shahrokh Daijavad, Elizabeth Foster, James L Hedrick Jr, Jeffrey C Hedrick, Rodney T Hodgson, Ashit A Mehta, Steven E Molis, Jane M Shaw, Stephen L Tisdale, Alfred Viehbeck: Fluorinated carbon polymer composites. International Business Machines Corporation, Scully Scott Murphy & Presser, November 5, 1996: US05571852 (8 worldwide citation)

Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.


8
James Economy, James L Hedrick Jr, Jeffrey W Labadie: Hot roll fusers comprising polyarylene elastomers. Lexmark International, John A Brady, September 24, 1991: US05051313 (1 worldwide citation)

Hot roll fusers are made with a matrix resin which is an elastomer having a glass transition between 90.degree. C. and 160.degree. C. and a structure represented by the formula X--Ar--Y--Ar--X wherein Ar is an aromatic ring structure, Y is O, S, C.dbd.O, SO.sub.2, C(CH.sub.3).sub.2, C(CF.sub.3).sub. ...


9
Kie Y Ahn, James L Hedrick Jr, Jeffrey W Labadie, Kang Wook Lee, Robert J Twieg, Alfred Viehbeck, George F Walker: Process for making a multileveled electronic package. IBM Corporation, Scully Scott Murphy & Presser, January 14, 1997: US05593720

A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.


10
Kie Y Ahn, James L Hedrick Jr, Jeffrey W Labadie, Kang Wook Lee, Robert J Twieg, Alfred Viehbeck, George F Walker: Poly(aryl ether benzimidazoles). IBM Corporation, Scully Scott Murphy & Presser, May 14, 1996: US05516874

A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.