1
Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G Lee, William Chou, Solomon I Beilin, Wen chou Vincent Wang, James J Roman, Thomas J Massingill: Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making. Fujitsu, Coudert Brothers, January 29, 2002: US06343171 (159 worldwide citation)

Opto-electrical systems having electrical and optical interconnections formed in thin layers with thin-film active devices are disclosed. In one embodiment, optical connections are made between the edge of one substrate and the surface of another substrate with the use of photorefractive materials. ...


2
Solomon I Beilin, William T Chou, David Kudzuma, Michael G Lee, Michael G Peters, James J Roman, Som S Swamy, Wen chou Vincent Wang, Larry L Moresco, Teruo Murase: Controlled impedence interposer substrate. Fujitsu, Coudert Brothers, December 29, 1998: US05854534 (113 worldwide citation)

An interposer substrate for mounting an integrated circuit chip to a substrate, and method of making the same, are shown. The interposer substrate comprises power supply paths and controlled impedance signal paths that are substantially isolated from each other. Power supply is routed though rigid s ...


3
Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G Lee, William Chou, Solomon I Beilin, Wen chou Vincent Wang, James J Roman, Thomas J Massingill: Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making. Fujitsu, Sheppard Mullin Richter & Hampton, January 18, 2005: US06845184 (101 worldwide citation)

Opto-electrical systems having electrical and optical interconnections formed in thin layers are disclosed. In one set of preferred embodiments, optical signals are conveyed between layers by respective vertical optical couplers disposed on the layers. In other preferred embodiments, optical signals ...


4
Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G Lee, William Chou, Solomon I Beilin, Wen chou Vincent Wang, James J Roman, Thomas J Massingill: Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making. Fujitsu, Sheppard Mullin Richter & Hampton, February 10, 2004: US06690845 (82 worldwide citation)

Three-dimensional opto-electronic modules having a plurality of opto-electronic (O/E) layers, with optical signals being routed between O/E layers within one or more three-dimensional volumes, are disclosed. In preferred embodiments, the O/E layers are disposed over and above one another with at lea ...


5
Lei Zhang, Solomon Beilin, Som S Swamy, James J Roman: Methods for fabricating flexible circuit structures. Fujitsu, Coudert Brothers, May 21, 2002: US06391220 (76 worldwide citation)

Methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer on substrate, and then forming a conductive laminate on the release layer. After the release layer is formed, the conductive laminate can be easily separated by the substr ...


6
Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G Lee, William Chou, Solomon I Beilin, Wen chou Vincent Wang, James J Roman, Thomas J Massingill: Opto-electronic substrates with electrical and optical interconnections and methods for making. Fujitsu, Coudert Brothers, August 26, 2003: US06611635 (72 worldwide citation)

Disclosed is device and/or material integration into thin opto-electronic layers, which increase room for chip-mounting, and reduce the total system cost by eliminating the difficulty of optical alignment between opto-electronic devices and optical waveguides. Opto-electronic devices are integrated ...


7
Wen chou V Wang, Solomon I Beilin, William T Chou, David Kudzuma, Michael G Lee, Michael G Peters, James J Roman, Som S Swamy: Method for fabricating thin-film interconnector. Fujitsu, Christie Parker & Hale, May 30, 1995: US05419038 (58 worldwide citation)

A three dimensional thin-film interconnector is fabricated by depositing a dielectric layer onto the surface of a substrate, depositing a layer of conductive material onto the dielectric layer to form a signal plane, depositing a dielectric layer onto the surface of the signal plane, forming a plura ...


8
Solomon I Beilin, William T Chou, David Kudzuma, Michael G Lee, Teruo Murase, Michael G Peters, James J Roman, Som S Swamy, Wen chou V Wang: Multichip module substrate. Fujitsu, Coudert Brothers, August 6, 1996: US05544017 (39 worldwide citation)

A multichip module substrate for use in a three-dimensional multichip module, and methods of making the same, are disclosed. The substrate comprises a thin film structure, for routing signals to and from integrated circuit chips, formed over a rigid support base. Apertures are formed in the support ...


9
Solomon I Beilin, William T Chou, David Kudzuma, Michael G Lee, Michael G Peters, James J Roman, Som S Swamy, Wen chou Vincent Wang, Larry L Moresco, Teruo Murase: Controlled impedance interposer substrate and method of making. Fujitsu, Coudert Brothers, August 15, 2000: US06102710 (38 worldwide citation)

An interposer substrate for mounting an integrated circuit chip to a substrate, and method of making the same, are shown. The interposer substrate comprises power supply paths and controlled impedance signal paths that are substantially isolated from each other. Power supply is routed through rigid ...


10
Sergey Savastiouk, Valentin Kosenko, James J Roman: Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques. Tru Si Technologies, Haynes and Boone, Michael Shenker, March 31, 2009: US07510928 (28 worldwide citation)

A portion of a conductive layer (310, 910) provides a capacitor electrode (310.0, 910.0). Dielectric trenches (410, 414, 510) are formed in the conductive layer to insulate the capacitor electrode from those portions of the conductive layer which are used for conductive paths passing through the ele ...