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James F Wenzel, Mona A Chopra, Stephen W Foster: Semiconductor device having built-in high frequency bypass capacitor. Motorola, June 3, 1997: US05635767 (155 worldwide citation)

A high frequency bypass capacitor (36, 36') is built into a thin-film portion (16, 16') of a polymer carrier substrate (15) of a PBGA (10). The carrier substrate (15) has both a stiffener (18) and a thin-film portion (16, 16') which has multiple metal layers (24, 28, 30, 32). The power supply planes ...


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James F Wenzel, Robert K DeHaven, Bryan D Marietta, James P Johnston: Multi-chip semiconductor device and method for making the device by using multiple flip chip interfaces. Motorola, November 21, 2000: US06150724 (138 worldwide citation)

A bump-bonded multi-chip flip-chip device (100) is formed by manufacturing a mother chip (102) having a first set (207) of bumps (212) and a second set (209) of bump contacts (210). A daughter chip (104) is also formed which has conductive bumps (312). The daughter chip (104) and the mother chip (10 ...


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Robert Keith DeHaven, James F Wenzel: Method for manufacturing a stimulus wafer for use in a wafer-to-wafer testing system to test integrated circuits located on a product wafer. Motorola, Keith E Witek, December 30, 1997: US05701666 (124 worldwide citation)

A method, apparatus, and circuit distribution wafer (CDW) (16) are used to wafer-level test a product wafer (14) containing one or more product integrated circuits (ICs). The CDW (16) contains circuitry which is used to test the ICs on the product wafers (14). A connection from the product wafer (14 ...


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Thomas F Lum, James F Wenzel: Method for probing a semiconductor wafer. Motorola, Patricia S Goddard, July 9, 1996: US05534784 (112 worldwide citation)

A method for probing a semiconductor wafer utilizes an array probe assembly (60) which includes a production package substrate (64). Substrate (64) is used to transform a configuration of conductive pads (74) on a probe card (62) into a configuration which matches that of conductive bumps (54) on a ...


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James F Wenzel, Carol G Pyron, Dawit Belete: Method for high speed testing a semiconductor device. Motorola, June 21, 1998: TW334607 (12 worldwide citation)

A method for high speed testing a semiconductor device, such as a processor (102), involves providing an array probe assembly (160) which includes a test substrate (164) having integrated circuits (104,106) mounted thereon. A first subset of interconnects (112) of the test substrate electrically con ...


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James F Wenzel, Mona A Chopra, Stephen W Foster: Semiconductor device having built-in high frequency bypass capacitor and method for its fabrication. Motorola, September 21, 1996: TW286433

A high frequency bypass capacitor (36, 36') is built into a ?thin-film portion (16, 16') of a polymer carrier substrate (15) ?of a PBGA (10). The carrier substrate (15) has both a stiffener ?(18) and a thin-film portion (16, 16') which has multiple metal ?layers (24, 28, 30, 32). The power supply pl ...


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