1
Shawki Ibrahim, James E Elsner: Multi-layer ceramic package. CTS Corporation, John A Young, Larry J Palguta, March 16, 1982: US04320438 (72 worldwide citation)

In a multi-layer ceramic package, a plurality of ceramic lamina each has a conductive pattern, and there is an internal cavity of the package within which is bonded a chip or a plurality of chips intereconnected to form a chip array. The chip or chip array is connected through short wire bonds at va ...


2
Shawki S Ibrahim, James E Elsner: Process of making multi-layer ceramic package. CTS Corporation, Larry J Palguta, John A Young, November 29, 1983: US04417392 (53 worldwide citation)

In a multi-layer ceramic package, a plurality of ceramic lamina each has a conductive pattern, and there is an internal cavity of the package within which is bonded a chip or a plurality of chips interconnected to form a chip array. The chip or chip array is connected through short wire bonds at var ...


3
Phillip S Fisher, James E Elsner, Dean A Marshall: Method of connecting internal silver traces to external gold to produce a gold external side metal for an LTCC package. Cts Corporation, June 15, 2006: US20060125074-A1

A method of connecting internal silver traces to external gold to produce a gold external side metal for a low-temperature co-fired ceramic package includes the deposition of a ruthenium dioxide cermet barrier layer between layers of gold and silver. An LTCC package constructed in accord with the in ...