1
David L Roper, James W Cady, James Wilder, James Douglas Wehrly Jr, Jeff Buchle, Julian Dowden: Pitch change and chip scale stacking system. Staktek Group, Andrews Kurth L, J Scott Denko, May 30, 2006: US07053478 (108 worldwide citation)

The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two int ...


2
James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr, Julian Dowden, Jeff Buchle: Chip scale stacking system and method. Staktek Group, June 10, 2003: US06576992 (105 worldwide citation)

The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, a pair of CSPs is stacked, with one CSP above the other. The two CS ...


3
Russell Rapport, James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr, Jeff Buchle: Memory expansion and chip scale stacking system and method. Staktek Group, Andrews Kurth, July 5, 2005: US06914324 (73 worldwide citation)

The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided her ...


4
Julian Partridge, James Douglas Wehrly Jr, David Roper: Stacked module systems and method. Staktek Group, Andrews Kurth, J Scott Denko, April 25, 2006: US07033861 (66 worldwide citation)

A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second selected locations on the flex circuitry. The flex circuitry and the combination of the form standard and C ...


5
James W Cady, Julian Partridge, James Douglas Wehrly Jr, James Wilder, David L Roper, Jeff Buchle: Low profile chip scale stacking system and method. Staktek Group, Andrews Kurth, J Scott Denko, April 11, 2006: US07026708 (64 worldwide citation)

The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile contacts are created by any of a variety of methods and materials. A consolidated low profile contact structure and technique is provided fo ...


6
James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr: Integrated circuit stacking system and method. Staktek Group, Andrews Kurth, J Scott Denko, October 18, 2005: US06956284 (61 worldwide citation)

The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred e ...


7
James Douglas Wehrly Jr: Contact member stacking system and method. Staktek Group, J Scott Denko, October 8, 2002: US06462408 (44 worldwide citation)

A system and method for selectively stacking and interconnecting individual integrated circuit devices to create a high-density integrated circuit module. In a preferred embodiment, conventional thin small outline packaged (TSOP) memory circuits are vertically stacked one above the other. The consti ...


8
James W Cady, Julian Partridge, James Douglas Wehrly Jr, James Wilder, David L Roper, Jeff Buchle: Low profile chip scale stacking system and method. Staktek Group, Andrew Kurth, J Scott Denko, August 22, 2006: US07094632 (39 worldwide citation)

The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile structures provide connection between CSPs of the stacked module and between and to the flex circuitry. Low profile contacts are created by ...


9
Paul Goodwin, James Douglas Wehrly Jr: Active cooling methods and apparatus for modules. Stakick Group, Fish & Richardson P C, October 30, 2007: US07289327 (33 worldwide citation)

A circuit module that includes a system for reducing thermal variation and cooling the circuit module. In preferred embodiments, the module includes a thermally-conductive rigid substrate having first and second lateral sides, an edge, and an integrated cooling component. The integrated cooling comp ...


10
James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr: Flex-based circuit module. Entorian Technologies, Fish & Richardson P C, September 29, 2009: US07595550 (28 worldwide citation)

A form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design that is disposed about the form. In a preferred embodiment, the form standard will be d ...