1
William L Brodsky, James D Herard, Thomas G Macek, Timothy L Sharp, George J Shovlowsky: Circuitized structure including flexible circuit with elastomeric member bonded thereto. International Business Machines Corporation, Lawrence R Fraley, November 21, 1995: US05468917 (38 worldwide citation)

A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e.g., copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is uti ...


2
William L Brodsky, James D Herard: Portable external flexible cable and package using same. International Business Machines Corporation, Lawrence R Fraley, November 21, 1995: US05468159 (33 worldwide citation)

This invention provides a means of using flexible (also often referred to as simply "flex") circuit structures for external cabling in a small light package, particularly those utilized in portable computers. The external cabling is composed of a flex circuit that is strengthened by fiber strands, a ...


3
Jeffrey Scott Campbell, James D Herard, Ronald Peter Nowak, John Robert Slack, David Brian Stone: Assembly for mounting components to flexible cables. International Business Machines Corporation, Baker Maxham Jester & Meador, September 23, 1997: US05669775 (19 worldwide citation)

A support structure is attached to the front or back side of a flexible circuit by direct mounting to the flexible circuit flat ribbon cable, thereby providing a stress-free region of the cable in which the flexible circuit electrical components can be mounted. The support structure comprises a flat ...


4
James D Herard, Steven R Herard: Solderless compliant socket. International Business Machines Corporation, Lawrence R Fraley, January 28, 1992: US05083927 (17 worldwide citation)

A socket for use within a circuit board's conductive opening, e.g., plated-thru-hole, to frictionally engage the opening's internal surface(s) and thereby retain the socket within the opening without the need for solder or the like material. The socket includes a first plurality, e.g., three, of res ...


5
John G Gaudiello, James D Herard, John J Konrad, Jeffrey McKeveny, Timothy L Wells: Process for manufacturing a printed wiring board. International Business Machines Corporation, Mark Levy & Associates PLLC, March 7, 2006: US07007378 (12 worldwide citation)

A process for manufacturing a land grid array connector for a printed wiring board is disclosed. The process does not require electroplating precious metal overlays. Therefore, no commoning bar is required. Another benefit of the invention includes a connector design using only a flash, soft gold ap ...


6
James D Herard: Electrical connector. International Business Machines Corporation, Lawrence R Fraley, March 14, 1995: US05397240 (11 worldwide citation)

An electrical connector for interconnecting first and second circuit members wherein the connector includes an insulative, e.g., plastic, housing having a cylindrical metallic conductor rod therein and at least one electrical contact positioned on or within the housing and having opposed conductive ...


7
Norman A Card Jr, James M Ergler, James D Herard, Paul R Kasperek, Richard S McKinley, Der jin Woan: Process for reworking circuit boards. International Business Machines Corporation, Lawrence R Fraley, Salzman & Levy, February 26, 2002: US06349871 (11 worldwide citation)

A method and apparatus is described for reworking a printed circuit board having plugged vias and plated through holes. The printed circuit board, supported by a movable local support, is heated from only the bottom side by a heating device near the area on the PCB that contains the plated through h ...


8
Donald S Farquhar, James D Herard, Michael J Klodowski, David Questad, Der jin Woan: Electronic package with optimized lamination process. International Business Machines Corporation, Schmeiser Olsen & Watts, William H Steinberg, June 13, 2006: US07059049 (5 worldwide citation)

An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperatur ...


9
Norman A Card Jr, James M Ergler, James D Herard, Paul R Kasperek, Richard S McKinley, Der jin Woan: Machine and process for reworking circuit boards. International Business Machines Corporation, Lawrence R Fraley, Salzman & Levy, April 17, 2001: US06216938 (1 worldwide citation)

A method and apparatus is described for reworking a printed circuit board having plugged vias and plated through holes. The printed circuit board, supported by a movable local support, is heated from only the bottom side by a heating device near the area on the PCB that contains the plated through h ...


10
Donald S Farquhar, James D Herard, Michael J Klodowski, David Questad, Der jin Woan: Electronic package with optimized lamination process. International Business Machines Corporation, Schmeiser Olsen & Watts, William H Steinberg, February 12, 2008: US07329816 (1 worldwide citation)

An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperatur ...