Alvin M Kong, James C Lau, Steven S Chan: Mass simultaneous sealing and electrical connection of electronic devices. TRW, September 5, 1995: US05448014 (124 worldwide citation)

The present invention provides a new and effective method for the sealing and electrical testing of electronic devices; and particularly for surface acoustic wave devices. In accordance with the present invention, the cost and size of making hermetically sealed packages for electronic devices and of ...

Yoshio Saito, James C Lau, Steven S Chan, Richard P Malmgren: On-wafer integrated circuit electrical testing. TRW, August 9, 1994: US05336992 (28 worldwide citation)

An electrical testing device is provided for testing integrated circuits located on a wafer. The testing device employs a multi-layer test circuit having a plurality of contacts for contacting the integrated circuits on a wafer. The layers of the test circuit are embedded in a flexible, supportive d ...

James C Lau, Kenneth Lui, Richard P Malmgren: Single crystal diamond wafer fabrication. TRW, Ronald L Taylor, March 1, 1994: US05290392 (14 worldwide citation)

This invention discloses a method of fabricating a plurality of diamond semiconductor wafers from a single crystal diamond semiconductor boule, where the diamond boule is grown by a chemical vapor deposition (CVD) process. Initially, a single crystal diamond seed is polished and an impurity layer is ...

James C Lau, Maurice Lowery, Kenneth Lui: Focused ion beam for thin film resistor trim on aluminum nitride substrates. TRW, Ronald L Taylor, November 30, 1993: US05266529 (10 worldwide citation)

A method for trimming thin film resistors. A focused inert ion beam is employed to selectively remove portions of a resistive film deposited on a substrate.

Alfred E Lee, Roger A Davidheiser, James C Lau: Method of making compact integrated microwave assembly system. TRW, Michael S Yatsko, Connie M Thousand, November 23, 1999: US05987732 (7 worldwide citation)

The invention relates to a method for producing low cost integrated microwave assemblies, where a photoresist layer is deposited onto a substrate, a portion of the photoresist is selectively removed, a first conductive layer is applied, and, a second portion of the photoresist is removed leaving iso ...

James C Lau, Richard P Malmgren, Kenneth Lui: Integrated waveguide/stripline transition. TRW, Ronald L Taylor, May 10, 1994: US05311153 (6 worldwide citation)

An integrated waveguide/stripline signal transition structure and method for fabricating the same are provided for allowing high frequency signal transitions. The signal transition structure includes a waveguide which has a conductive cavity for guiding electromagnetic waves therethrough. A first co ...

James C Lau: Equipotential fault tolerant integrated circuit heater. TRW, Ronald M Goldman, December 10, 2002: US06492620 (6 worldwide citation)

Fault tolerance is incorporated within the integral electric heaters of a reworkable electronic semiconductor component, such as a reworkable multi-chip module, to increase production yield and longevity of the rework feature. Components of the foregoing kind contain a multi-layer substrate to bond ...

James C Lau: Brush gear for an electric motor. Johnson Electric Industrial Manufactory, Fleit Jacobson Cohn Price Holman & Stern, November 28, 1989: US04883998 (4 worldwide citation)

An electric motor has a can-like casing and an end cap. Brushgear is mounted on a frame prior to insertion into the motor. The frame holds the brushes of the brush gear away from a commutator of the motor by means of resilient arms which engage the brush gear. As the frame is inserted into the motor ...

James C Lau, Charles C Ruth: Method of sensing a gas concentration. TRW, December 20, 1994: US05373724 (2 worldwide citation)

A resealable gas concentration sensor for determining the concentration of a particular gas within a gaseous environment. The sensor is constructed of a housing and a cap. The cap is adapted to be temporarily coupled with the housing while in the environment to define a sealed sample chamber, thereb ...

Christian L Marquez, James C Lau, Paul J Hamilton: Low cost integrated heater substrate for active optical fiber alignment. Warn Burgess & Hoffmann PC, June 17, 2004: US20040114882-A1

An optical packaging assembly (10) for securing an optical fiber (12) to a heater substrate (30) in optical alignment with an opto-electronic device (14). The opto-electronic device (14) is secured to a device substrate (18) in the packaging assembly (10). The heater substrate (30) includes a conduc ...

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