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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Giles Humpston, Jae M Park: Microelectronic package comprising offset conductive posts on compliant layer. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 26, 2012: US08207604 (31 worldwide citation)

A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from t ...


2
Belgacem Haba Belgacem (Bel) Haba
Teck Gyu Kang, Michael Estrella, Jae M Park, Kenneth Robert Thompson, Craig S Mitchell, Belgacem Haba: Image sensor package and fabrication method. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 6, 2008: US07368695 (18 worldwide citation)

An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent ...


3
Belgacem Haba Belgacem (Bel) Haba
Yoichi Kubota, Teck Gyu Kang, Jae M Park, Belgacem Haba: Components with posts and pads. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 24, 2009: US07495179 (17 worldwide citation)

A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Yoichi Kubota, Teck Gyu Kang, Jae M Park: Fine pitch microcontacts and method for forming thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 4, 2014: US08641913 (8 worldwide citation)

A method includes applying a final etch-resistant material to an in-process substrate so that the final etch-resistant material at least partially covers first microcontact portions integral with the substrate and projecting upwardly from a surface of the substrate, and etching the surface of the su ...


5
Belgacem Haba Belgacem (Bel) Haba
Yoichi Kubota, Teck Gyu Kang, Jae M Park, Belgacem Haba: Method of making a connection component with posts and pads. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 1, 2011: US08046912 (3 worldwide citation)

A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of ...


6
Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Jae M Park, Belgacem Haba, Fion Tan, Philip R Osborn: Microelectronic connection components having bondable wires. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2007: US07268304 (2 worldwide citation)

A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be f ...


7
Belgacem Haba Belgacem (Bel) Haba
Yoichi Kubota, Teck Gyu Kang, Jae M Park, Belgacem Haba: Method of making a connection component with posts and pads. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 10, 2013: US08604348 (1 worldwide citation)

A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Jae M Park, Teck Gyu Kang, Nicholas J Colella: Microelectronic assemblies with springs. Tessers, Lerner David Littenberg Krumholz & Mentlik, December 4, 2007: US07304376 (1 worldwide citation)

A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, r ...


9
Belgacem Haba Belgacem (Bel) Haba
Yoichi Kubota, Teck Gyu Kang, Jae M Park, Belgacem Haba: Method of making a connection component with posts and pads. Tessera, October 27, 2011: US20110260320-A1

A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of ...


10
Belgacem Haba Belgacem (Bel) Haba
Philip R Osborn, Belgacem Haba, Ellis Chau, Giles Humpston, Masud Beroz, Teck Gyu Kang, Dat Nghe Duong, Jae M Park, Jesse Burl Thompson, Richard Dewitt Crisp: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, August 7, 2008: US20080185705-A1

A microelectronic package includes a microelectronic element having a first face including contacts, and a flexible substrate having a first surface and a second surface, conductive posts projecting from the first surface and conductive terminals accessible at the second surface, at least some of th ...



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