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Christopher Bongiovanni, Jack Boyd, Christopher Pederson: Bismaleimide resin system with improved manufacturing properties. Cytec Technology, David LeCroy, March 5, 2013: US08389631 (1 worldwide citation)

The present invention is a thermosetting bismaleimide resin system comprising a liquid phase and a solid phase where the non-crystallizing liquid phase contains the curing agents diallyl ether of a substantially aromatic radical and a bis(alkenylphenoxy) ether of a substantially aromatic radical alo ...


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Jack Boyd, Christopher L Bongiovanni, Bryan Thai: Bismaleimide resin with high temperature thermal stability. Robert R Neller, Cytec, May 24, 2007: US20070117956-A1

The present invention is for the use of aliphatic bismaleimide compounds in epoxy resin systems to increase the thermal aging properties of a cured resin system through reduced microcracking as measured by reduced weight loss after thermal aging. The present invention further provides a BMI resin fo ...


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Christopher Bongiovanni, Jack Boyd, Christopher Pederson: Bismaleimide resin system with improved manufacturing properties. Cytec, August 27, 2009: US20090215961-A1

The present invention is a thermosetting bismaleimide resin system comprising a liquid phase and a solid phase where the non-crystallizing liquid phase contains the curing agents diallyl ether of a substantially aromatic radical and a bis(alkenylphenoxy) ether of a substantially aromatic radical alo ...